[chapter] Extraction for a 65nm FG Transistor.

[chapter] Cong, T.D., Hoang, T. (2023). A Methodology of Extraction DC Model for a 65 nm Floating-Gate Transistor. 

In: Dao, NN., Thinh, T.N., Nguyen, N.T. (eds) Intelligence of Things: Technologies and Applications. ICIT 2023. Lecture Notes on Data Engineering and Communications Technologies, vol 187. Springer, Cham. https://doi.org/10.1007/978-3-031-46573-4_19

Abstract: Floating-gate Metal-Oxide Semiconductor (MOS) has been investigated and applied in many applications such as artificial intelligence, analog mixed-signal, neural networks, and memory fields. This study aims to propose a methodology for extracting a DC model for a 65 nm floating-gate MOS transistor. The method in this work uses the combination architecture of MOS transistor, capacitance, and voltage-controlled voltage source which can archive a high accuracy result. Moreover, the advantage of the method is that the MOS transistor was a completed model which enhances the flexibility and accuracy between a fabricated device and modeled architecture. In our work, the industrial standard model Berkeley Short-channel IGFET Model (BSIM) 3v3.1, level 49 was deployed, and the DC simulation was obtained with the use of LTspice tool.

Sub-Minimum-Area MPW Sharing

Is Your Multi-Project Wafer Project Smaller Than the Fab Minimum Area?

Share the minimum area with other MPW customers to save mask costs

With the cost of mask sets going up with every node, even a multi-project wafer (MPW) can break your NRE budget, particularly if you plan to run multiple test spins. At 28nm, a 6mm2 area tile can cost over $100,000.

One solution is to share the minimum tile area with someone else who is using the same technology and metal stack that you are targeting. We periodically get these kinds of requests from customers. Please contact directly star@esilicon.com if you would like eSilicon to list your own MPW shuttle sharing opportunity, or if you would like eSilicon to contact you when future MPW tile sharing opportunities are available.

Following are upcoming opportunities to share a multi-project wafer (MPW) tapeout with another eSilicon customer. If you are interested, just email eSilicon.

Multi-Project Wafer Minimum Tile Sharing Opportunities for TSMC Technologies

Tapeout Month	Technology	Metal Stack	I/O	Price/mm2	Minimum Area	Final GDSII Due	Tapeout Date	Estimated Ship Date
October	65nm MS RF GP	1P9M_6x1z1u	2.5V	$4,700	1mm2	October 10	October 12	November 23
	65nm MS RF LP	1P9M_6x1z1u	2.5V	$4,700	1mm2	October 10	October 12	November 23
	180nm MS RF G	1P6M_4x1u	3.3V	$1,000	5mm2	October 24	October 26	December 7
November	40nm MS RF LP	1P10M	1.8V	$7,500	1mm2	October 31	November 2	January 17

[read more...]