Oct 27, 2020

[paper] Wearable Circuits for Health Monitoring

Ling Zhang, †,‡,§ Hongjun Ji, †,‡,# Houbing Huang, ^ Ning Yi, ǂ,& Xiaoming Shi, ^ Senpei Xie, ‡,# Yaoyin Li, ‡,# Ziheng Ye, # Pengdong Feng, ‡,# Tiesong Lin, † Xiangli Liu, # Xuesong Leng, † Mingyu Li, †,‡,# Jiaheng Zhang, †,‡,# Xing Ma, †,‡,# Peng He, † Weiwei Zhao, †,‡,#
and Huanyu Cheng, §,ǂ
Wearable Circuits Sintered at Room Temperature Directly on The Skin Surface for Health Monitoring
ACS Appl. Mater. Interfaces 2020, 12, 40, 45504–45515
Publication Date:September 11, 2020
DOI: 10.1021/acsami.0c11479

†State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen, 518055, People’s Republic of China
‡Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen, 518055, People’s Republic of China
§Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA.
#The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen, 518055, People’s Republic of China
^Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China
ǂDepartment of Materials Science and Engineering, The Pennsylvania State University, University Park, PA 16802, USA.

Abstract: A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) for signal conditioning/readout and wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing on a carrier substrate before attaching to the body. Here we report a universal fabrication scheme to enable printing and room-temperature sintering of metal nanoparticle on paper/fabric for FPCBs and directly on the human skin for on-body sensors with a novel sintering aid layer. Consisting of polyvinyl alcohol (PVA) paste and nanoadditives in the water, the sintering aid layer reduces the sintering temperature. Together with the significantly decreased surface roughness, it allows for the integration of a submicron-thick conductive pattern with enhanced electromechanical performance. Various on-body sensors integrated with an FPCB to detect health conditions illustrate a system-level example.
Fig: Print These Electronic Circuits Directly Onto Skin by spectrum.ieee.org

Acknowledgment: This work was supported by several grants provided by The Pennsylvania State University and National Science Foundation (NSF) (Grant No. ECCS-1933072) to H.C., as well as Shenzhen Science and Technology Program (Grant No. KQTD 20170809110344233, JCYJ 20170811160129498) and Bureau of Industry and Information Technology of Shenzhen through the Graphene Manufacturing Innovation Center (201901161514). X.L. acknowledges the support from the Natural Science Foundation of China (11672090)

[Open PhD] IMEC: Modeling of hybrid nanofluidic-nanoelectronic devices for single-molecule biosensing



from Twitter https://twitter.com/wladek60

October 27, 2020 at 09:15AM
via IFTTT

Fwd: IEEE-EDS Santa Clara Valley/San Francisco Chapter October Seminar (Webex only)

Please note that this seminar is now WEBEX participation only. 

Coupled Oscillator based Computing: Using Nature to Solve Difficult Problems
Prof. Chris H. Kim, University of Minnesota
Friday, October 30, 2020 at 11AM – noon PDT


Abstract:
In this talk, I will introduce a first-of-its kind quantum-inspired coupled oscillator based compute engine implemented in a standard 65nm technology targeted for NP-hard or NP-complete problems such as max-cut, graph coloring, traveling salesman, and pattern recognition. The NP-hard problem is first mapped to the coupling weights while the solution is represented by the phases of the individual oscillators, which are read out using on-chip phase sampling circuits. Our hardware exploits the natural tendency of a network of coupled oscillator to settle to the ground state, which offers significant performance and power advantages compared to traditional digital approaches.

Speaker Bio:
Chris H. Kim received his B.S. and M.S. degrees from Seoul National University and a Ph.D. degree from Purdue University. He is currently a professor at the University of Minnesota. Prof. Kim is the recipient of the University of Minnesota Taylor Award for Distinguished Research, SRC Technical Excellence Award, Council of Graduate Students Outstanding Faculty Award, NSF CAREER Award, Mcknight Foundation Land-Grant Professorship, 3M Non-Tenured Faculty Award, DAC/ISSCC Student Design Contest Award, IBM Faculty Partnership Award, IEEE Circuits and Systems Society Outstanding Young Author Award, the ICCAD Ten Year Retrospective Most Influential Paper Award, ISLPED Low Power Design Contest Award (4 times), and ISLPED Best Paper Award (2 times). His group has expertise in digital, mixed-signal, and memory IC design, with special emphasis on circuit reliability, hardware security, memory circuits, radiation effects, time-based circuits, beyond-CMOS technologies, and machine learning hardware design. He is an IEEE fellow.


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Oct 26, 2020

[paper] 2D-SFET Based SRAMs

Niharika Thakuria, Graduate Student Member, IEEE, Daniel Schulman, Member, IEEE, Saptarshi Das, Member, IEEE, and Sumeet Kumar Gupta, Member, IEEE
2D Strain FET (2D-SFET) Based SRAMs - Part I: Device-Circuit Interactions
 IEEE TED, vol. 67, no. 11, pp. 4866-4874, Nov. 2020
DOI: 10.1109/TED.2020.3022344.

Abstrat: In this article, we analyze the characteristics of a recently conceived steep switching device 2-D Strain FET (2D-SFET) and present its circuit implications in the context of 6T-SRAM. We discuss the dependence of 2D-SFET characteristics on key design parameters, showing up to 2.7× larger ON-current and 35% decrease in subthreshold swing when compared to 2D-FET. We analyze the performance of 2D-SFET (as drop-in replacement for standard 2D-FET) in 6T-SRAM for a range of design parameters and compare those to 2D-FET 6T-SRAM. 2D-SFET 6T-SRAM achieves up to 5.7% lower access time, 63% higher write margin, and comparable hold margin, but at the cost of comparable to 11% lower read stability and 16% increase in write time. In Part II of this article, we mitigate the read stability issues of 2D-SFET SRAMs by proposing VB-enabled SRAM designs.
Fig: 2D-SFET model with bandgap reduction and 2-D-electrostatics [18]. COX, CGS/D,F, CIT, and CGB are oxide, gate (G) to source (S)/drain (D) fringe, trap, and PE capacitance, respectively. VFB, and VFBS are flat-band voltage of G and back contact. VQFL(VS,VD) is S/D quasiFermi level. ΔEG(VG'B) is VGB dependent bandgap change, τEG is strain transduction delay, and REG is resistance used to model τEG. ΔEG(τEG) is final bandgap reduction considering τEG, used for calculating channel charge, QCH(ΔEG(τEG)).

Aknowlegement: This work was supported in part by NSF under Grant 1640020, in part by Nanoelectronics Research Corporation (NERC), and in part by Semiconductor Research Corporation (SRC) under Grant 2699.003

[CAS Seasonal School] How Technology is Impacting Agribusiness

How Technology is Impacting Agribusiness

A CAS seasonal school on technology and agribusiness will be held virtually from November 16th to November 20th. The program is quite interesting and we invite you to register through our web page www.asic-chile.cl. Registration is free.

The current world population of 7.6 billion is expected to reach 9.8 billion in 2050. According to the United Nations Food and Agriculture Organization (FAO) global agricultural productivity must increase by 50% – 70% to be able to feed the world population in 2050. Other researchers consider that reducing the waste of food would be enough.

Factors if not obstacles to be considered to meet global food demand by 2050 and beyond:
  • Less arable land: As cities are growing, the space allowed to agriculture is shrinking.
  • Climate change: Impacting dramatically agribusiness.
  • Role of the agribusiness on the GHG emissions.
  • Planet boundaries and the role of agribusiness.
  • Availability of freshwater.
  • Soil degradation.
The need has never been greater for innovative and sustainable solutions and technology should lead to significant improvement in our food and nutritional security.

In this seasonal school prestigious researchers and experts from all over the world will present the problems and challenges agribusiness is facing and how technologies such as IoT, AI, Machine Learning, sensors, electronic circuits, electronic systems, ICs, etc., can be applied to improve and solve the majority of those problems.

This is the first of a series of “Technology and Agribusiness” Seasonal Schools. It will be a meeting point for professionals working on Precision and Smart Agriculture, as well as professionals working on IoT, sensors, electronic circuits, electronic systems, ICs, etc.

We invite you to participate in this first version of the Technology and Agribusiness Seasonal School, which due to the pandemic will be 100% online and free of charge.

Join us!