Qucs-S 0.0.21 released

Qucs-S 0.0.21 has been released by Vadim Kuznetsov. It's a special Qucs version that allows to run Ngspice/Xyce simulators from the Qucs GUI. This release contains mostly bugfixes and small improvements. Here the short changelog:

1. Redesign of Parameter Sweep. Enabled sweep for log and list parameter type.
2. Fixed Voltage probe bug
3. Fixed missing phase of AC source
4. Added SMD resistor model

See release notes and download links here:
https://github.com/ra3xdh/qucs_s/releases/tag/0.0.21

Linux tarball and DEB/RPM packages are available. Windows installer will be added later.
See also https://ra3xdh.github.io/ for documentation and more info about Qucs-S.

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The #Digitization Of #China And Opportunities For #OpenSource Collaboration https://t.co/RNgs4kYilz

The #Digitization Of #China And Opportunities For #OpenSource Collaboration https://t.co/RNgs4kYilz

— Wladek Grabinski (@wladek60) October 26, 2018

from Twitter https://twitter.com/wladek60

October 26, 2018 at 01:01PM
via IFTTT

FOSDEM 2019 CAD and Open Hardware Devroom Call for Participation

This is the call for participation in the FOSDEM 2019 devroom on Computer Aided Design (CAD) tools and Open Hardware, to be held on Sunday 3 February 2019 in Brussels, Belgium. We are looking for contributions under the form of talks and tutorials covering the following main topics:

• Printed Circuit Board (PCB) design tools (e.g. KiCad and gEDA)
• Analogue and digital simulators (e.g. ngspice, Qucs, Gnucap, Xyce, GHDL, Icarus and Verilator)
• Any other EDA tools such as high-level tools for digital hardware design (e.g. Migen) and HDL synthesis tools (e.g. Yosys)
• Field solvers such as openEMS
• Mechanical 2D and 3D CAD tools such as LibreCAD, FreeCAD, OpenSCAD and SolveSpace
• Open Hardware projects such as the Teres laptop and the lowRISC SoC
• Inter-project opportunities for collaboration

We hope to provide an opportunity for attendees to bring themselves up to date on the latest FOSS CAD and Open Hardware developments, share knowledge and identify opportunities to collaborate on development tasks. This devroom is an evolution of the EDA devroom we organised in 2015, 2016 and 2017, which enlarged its scope in the CAD and Open

Hardware devroom in 2018.

Please submit your proposals at
https://penta.fosdem.org/submission/FOSDEM19 

before 1 December 2018.

Important dates
8 December 2018: deadline for submission of proposals
15 December 2018: announcement of final schedule
3 February 2019: devroom day

Michael Shur winning the 2018 IEEE EDS J.J. Ebers Award

Congratulations to Prof. Michael Shur for winning the 2018 IEEE EDS J.J. Ebers Award "For pioneering the concept of ballistic transport in nanoscale semiconductor devices"

Recent Winners of the J.J. Ebers Award

2017 - Kang L. Wang "For contributions and leadership in strained SiGe and magnetic memory technologies"

2016 - Jaroslav Hynecek "For the pioneering work and advancement of CCD and CMOS image sensor technologies"

2015 - Jack Yuan-Chen Sun "For sustained leadership and technical contributions to energy efficient foundry CMOS technologies"

2014 - Joachim N. Burghartz "For contributions to integrated spiral inductors for wireless communication ICs and ultra-thin silicon devices for emerging flexible electronics"

2013 - Nobukazu Teranishi "For development of the Pinned Photodiode concept widely used in Image Sensors”

2012 - Yuan Taur "For contributions to the advancement of several generations of CMOS process technologies"

2011 - Stuart Ross Wenham “For technical contributions and successful commercialization of high efficiency solar cells”

2010 - Mark E. Law “For contributions to widely used silicon integrated circuit process modeling”

1st Latin American Electron Devices Conference in Colombia

The 1st Latin American Electron Devices Conference (LAEDC 2019) will be held from February 24 to 27 2019 in Armenia, Colombia.

It will take place in parallel with the 2019 Latin American Symposium on Circuits and Systems (2019 LASCAS), also from February 24 to 27 2019 in Armenia, Colombia.


LAEDC is intended to be a top international conference about electron devices. It is thought to become the Latin American equivalent to ESSDERC in Europe. As ESSDERC is held in parallel with a solid state circuits conference, ESSDERC, LAEDC will be organized in combination with LASCAS.

LAEDC will also be the Latin American equivalent to the Electron Devices Technology and Manufacturing Conference (EDTM), organized every year in Asia.

Proceedings will be published by IEEE and will be available on IEEE Xplore.

There is a negotiation to publish a Special Issue in a top journal  containing extended versions of selected papers presented in LAEDC.

One of the topics of LAEDC is Modeling and Simulation. All electron devices can be targeted.

The deadline for paper submission is October 15 2018.

Armenia City is the capital of the department of Quindio. It is located in the Colombian region known as the coffee triangle. Since 2011, this region is recognized by the UNESCO as a world cultural heritage due to its exceptional landscapes that are the mixture of natural beautifulness and cultural traditions around the coffee growing. Different theme parks related to cultural and agricultural traditions are also located in the department of Quindio, which turns out the LAEDC an opportunity not only for academic exchange but also for knowing and enjoying the traditions around the coffee growing.

As Publication Chair, I strongly encourage researchers in device modeling to submit papers to the  1st Latin American Electron Devices Conference!