2016 IEDM Tutorials

2016 International Electron Devices Meeting Tutorials

The tutorials are in their sixth year and are 90 minute stand-alone presentations on specialized topics taught by world-class experts. These tutorials provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. The tutorial sessions will take place on Saturday, Dec.3, 2016. Three tutorials are given in parallel in two time slots, at 2:45 p.m.and 4:30 p.m. respectively.

Topics presented at 2:45pm - 4:15pm:

• The Struggle to Keep Scaling BEOL, and What We Can Do Next
  Rod Augur, Distinguished Member of the Technical Staff, GlobalFoundries
• Physical Characterization of Advanced Devices
  Robert Wallace, Univ. Texas at Dallas
• Spinelectronics: From Basic Phenomena to Magnetoresistive Memory (MRAM) Applications
  Bernard Dieny, Chief Scientist, Spintec CEA

Topics presented at 4:30pm - 6:00pm:

• Electronic Circuits and Architectures for Neuromorphic Computing Platforms
  Giacomo Indiveri, Univ. of Zurich and ETH Zurich
• Present and Future of FEOL Reliability—from Dielectric Trap Properties to Reliable Circuit Operation
  Ben Kaczer, Principal Scientist, IMEC
• Embedded Systems and Innovative Technologies for IoT Applications
  Ali Keshavarzi, Vice President of R&D, Cypress Semiconductor

Register for the IEDM tutorials here: http://ieee-iedm.org/onsite-registration-center/online-registration/

EKV302.00 in Cadence MMSIM 14.10

EKV302.00 is available in Cadence MMSIM 14.10. The new version can be accessed through version control parameter. It includes several enhancements, new flicker noise model and new operating point features.

INFOS 2017 in Potsdam, Germany

20th Conference on “Insulating Films on Semiconductors” 

INFOS 2017

June 27th – 30th, 2017 in Potsdam, Germany

The INFOS conference is a prestigious biennial event which brings together electrical engineers, technologists, materials scientists, device physics and chemists from Europe and around the world to debate the latest development in thin insulating film technology and identify as well as address challenges ahead in this highly diversifying field [read more...]

Conference Topics:

• High-k dielectrics, metal gate materials and SiO2 for future scaling
• Gate stack materials for high mobility substrates (Ge, SiGe, GaN, III-V)
• Stacked dielectrics for non-volatile memory (flash, nc-Si)
• Dielectrics for resistive switching memories and spin memories
• Dielectrics for DRAM and MIM
• Low-k dielectrics
• Semiconductors on insulators
• Dielectrics for 2D materials, nanowires, 2D devices and carbon-based devices
• Surface cleaning technologies
• Physics and chemistry of dielectrics and defects
• Characterization techniques for dielectrics and interfaces
• Electrical reliability, leakage and modelling
• Modelling of atomic structure of dielectrics, interfaces and thin films
• Topological insulators
• Ferroelectrics and functional oxides
• Dielectrics and thin films for TFT, amorphous or organic devices and photovoltaics
• Dielectrics for photonics and sensing

Creating A PCB In Everything: KiCad, Part 1 https://t.co/gSqz7GGbnE #todo #feedly #papers

Creating A PCB In Everything: KiCad, Part 1 https://t.co/gSqz7GGbnE #todo #feedly #papers

— Wladek Grabinski (@wladek60) November 17, 2016

from Twitter https://twitter.com/wladek60

November 17, 2016 at 11:23PM
via IFTTT

Open Source License Compliance bei Embedded-Systemen

Open Source License Compliance bei Embedded-Systemen 

( Kompaktseminar, ESE Kongress 2016, in Sindelfingen )

Referent: Dr. Till Jaeger, JBB Rechtsanwälte

Zeit: 28.11.16 09:00-12:30

Abstract: When using Linux and other open source software (OSS), the license terms of the GPL and other open source licenses must be adhered to. As license violations lead directly to copyright infringements, appropriate compliance measures are necessary. The compact seminar presents the essential requirements for a compliance process based on the OpenChain Initiative. OpenChain aims at an international standard for suppliers using OSS in your products.

Outline:

1. What is Open Source Software?
2. How does the open source license model work?
3. Legal consequences of violation of OSS license terms
4. How is it ensured that the use of OSS is known and which licensing conditions are affected?
5. The Copyleft (1): When must self-development be released again as OSS?
6. Copyleft (2): Verification of license compatibility between different OSS licenses
7. Process to comply with sales obligations (for example, source code offer, co-delivery license texts)
8. Methods of quality control

[read more...]