[C4P] IEEE AUTOTESTCON 2023

Deadline to submit abstracts is 15 February 2023

View this email in your browser Call For Papers AUTOTESTCON is the world's premier conference that brings together the military/aerospace automatic test industry and government/military acquirers and users to share new technologies, discuss innovative applications, and exhibit products and services. It is sponsored annually by the Institute of Electrical and Electronic Engineers (IEEE).   AUTOTESTCON will be held at the Gaylord National Harbor Resort, National Harbor, MD, USA, on August 28-31, 2023. The technical program for AUTOTESTCON 2023 will be determined by the interests of those participants submitting for publication, presenting a technical paper, or organizing a technical session. Papers and sessions should cover appropriate topics dealing with increasing DoD systems availability and automatic test technology in particular. Learn More Key Topics » Spiral Development and Evolutionary Acquisition » Flexible Sustainment » Interoperability » Design-For-Test/Built-In-Test » Fault Tolerant Systems » Legacy ATE Challenges » Future Logistics Support Concepts » Contractor Logistics Support » Maintenance Repair & Overhaul » Multinational Integrated Support » Commercialization of Military Maintenance » Electronic Warfare Test and Applications » CMMI Application to ATE/TPS Development » DMSMS Approaches » Organizational, Intermediate, Depot Level Maintenance For The Future » Next Generation Test Systems » Test Program Set Development » Prognostics » Test Requirements Definition and Verification » Factory and Development Test » Software Testing and Research » Development in Instrumentation and Measurement Download CFP Submission Information Abstracts are to be submitted to EDAS no later than February 15, 2023. Submit Paper(s) Here Questions? Website Email Sponsors Copyright © 2023 IEEE, All rights reserved. You are receiving this email because of your membership in IEEE Aerospace & Electronics Systems Society. Our mailing address is: IEEE 445 Hoes Lane Piscataway, NJ 08854-4141 USA IEEE Private Policy Want to change how you receive these emails? You can update your preferences or unsubscribe from this list.

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UPCOMING – Winter School in III-Sb applications

UPCOMING

Winter School in III-Sb applications: non-volatile memories

A Modelling Perspective

QUANTIMONY’s Winter School in III-Sb Applications: non-volatile Memories: a Modelling Perspective will take place from February 27th to March 3rd 2023 at the premises of the Technical University of Berlin.

The 5-day event will focus on the design and scalable production of a new III-Sb patented memory device (ULTRARAM TM). There will be a combination of specialised lectures by international experts, and hands-on tutorials/lab sessions as well as live demonstrations of the latest TCAD/EDA tools organised by the Technical University of Berlin.

The event will provide with an excellent opportunity for networking with leaders in the field.

List of Confirmed Speakers Invited Speakers and Hands - on Session:

• Prof. Dr. Manus Hayne, Lancaster University Birth of the ULTRARAM TM Concept
• Prof. Dr. Dieter Bimberg, Technische Universität Berlin Quantum Dot-Based Flash Memories: The Holy Grail at Sunrise?
• Dr. Petr Klenovský, Masaryk University, Brno Modeling Electronic states of IlI-Sb guantum systems on GaP substrate
• Dr. Wladek Grabinski, MOS-AK (EU) FOSS TCAD/EDA Tools for Compact Modeling
• Prof. Vihar Georgiev, James Watt School of Engineering, Glasgow Nano-electronic Simulation Software (NESS): a flexible nano-device simulation platform
• PD Dr. Uwe Bandelow, WIAS Berlin TBA
• Prof. Claudia Dr.axl, Humboldt Universität Berlin Unsupervised learning for insight into high-throughput calculations
• Rabea Pons, Comsol, Göttingen Introduction into COMSOL and hands-on session
• Prof. Dr. Mathieu Luisier, ETH Zürich TBA
• Dr. Marc Bescond, Faculté des Sciences de Saint Jérôme, NQS group, Marseille TBA
• Dr. Chetan Gupta, Micron Technology (R&D) Industry perspective on memory technologies
• Prof. Dr. Jannik Wolters, Deutschen Zentrum für Luft- und Raumfahrt / TU Berlin Quantum Memories and Introduction into Quantum Technologie

More information 

33rd IEEE MIEL 2023

We would like to inform you that 33rd IEEE International Conference on Microelectronics (MIEL 2023) will be held in Niš from October 16th-18th, 2023.

Accepted papers will be published in the Proceedings of the MIEL 2023 Conference, and included in IEEE Xplore database, subject to regular registration of at least one of the authors before August 31st, 2023.

We are pleased to invite you, as an expert in the field of microelectronics, to submit a paper to MIEL 2023 Conference and to encourage colleagues to do it. The deadline for the submission of two page-extended summaries (including figures, tables, and references) is April 28th, 2023.

Important Dates

• December 31, 2022 First Announcement and Call for Papers
• April 28, 2023 Deadline for Receipt of Abstracts
• June 23, 2023 Notification on Acceptance of Papers
• August 31, 2023 Deadline for registration
• August 31, 2023 Deadline for Receipt of Papers
• September 22, 2023 Dispatch of Conference Programme

Looking forward to receiving your abstract for MIEL 2023 Conference, we remain with

Best regards,

Vojkan Davidović
Danijel Danković

http://miel.elfak.ni.ac.rs/
Please contact miel@elfak.ni.ac.rs for further information.

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#TSMC is mulling an automotive #semi #fab in #Europe https://t.co/TDeiZXztLu https://t.co/MQ3nH0XlOR

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