[mos-ak] [2nd Announcement and C4P] 3rd MOS-AK LAEDC Workshop (virtual/online) April 18, 2021

2nd Announcement and C4P

Together with  local organization team, International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have the pleasure to invite to 3rd consecutive MOS-AK Compact/SPICE Modeling Workshop which will be organized as the virtual/online event on April 18, 2021 preceding the LAEDC Conference.

Planned virtual 3rd MOS-AK LAEDC Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.

Venue: Virtual/Online at LAEDC Conference

Online Workshop Registration to be in April 2021, 

any related enquiries can be sent to registration@mos-ak.org

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:

• Compact Modeling (CM) of the electron devices
• Advances in semiconductor technologies and processing
• Verilog-A language for CM standardization
• New CM techniques and extraction software
• Open Source (FOSS) TCAD/EDA modeling and simulation
• CM of passive, active, sensors and actuators
• Emerging Devices, Organic TFT, CMOS and SOI-based memory cells
• Microwave, RF device modeling, high voltage device modeling
• Nanoscale CMOS, BiCMOS, SiGe, GaN, InP devices and circuits
• Technology R&D, DFY, DFT and reliability/aging IC designs
• Foundry/Fabless Interface Strategies

Online Abstract Submission to be open, 

any related enquiries can be sent to abstracts@mos-ak.org

Important Dates: 

• Call for Papers - Dec. 2020
  
• 2nd Announcement - March 2020
• Final Workshop Program - April 2020
• MOS-AK Workshop April 18, 2021

W.Grabinski for Extended MOS-AK Committee

WG23032021

--
You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to mos-ak+unsubscribe@googlegroups.com.
To view this discussion on the web visit https://groups.google.com/d/msgid/mos-ak/CALp-Rj_qCy53wUsXOkXoAgCCS7-FCHgHfGkeEyYsuPJtXx2Qiw%40mail.gmail.com.

[EETimes] (Re)Shoring Up #semi Manufacturing - https://t.co/fNy0FgOiEG https://t.co/mVhn0SPjOS

[EETimes] (Re)Shoring Up #semi Manufacturing - https://t.co/fNy0FgOiEG pic.twitter.com/mVhn0SPjOS

— Wladek Grabinski (@wladek60) March 23, 2021

---

from Twitter https://twitter.com/wladek60

March 23, 2021 at 03:22PM
via IFTTT

Virtual Si Museum /2111/ E.Eng Tools

This is how I was introduced to the engineering. My very fist log rule and my HP-21 scientific calculator (successor of the famous HP-35)

REF:

[1] Slide rule: https://en.wikipedia.org/wiki/Slide_rule

[2] HP-21 scientific calculator: https://en.wikipedia.org/wiki/HP-21

[Extended C4P] ESSDERC Track3 "Compact Modeling and Process/Device Simulation"

51st European Solid-State Device Research Conference ESSDERC

47th  European Solid-State Circuits Research Conference ESSCIRC  

will be held together in hybrid format in Grenoble in September this year

https://www.esscirc-essderc2021.org/

The conferences will be arranged in three device-related tracks, three joint tracks, and seven circuit-related tracks. Among the device-related there will be the Track3: "Compact modeling and process/device simulation" (including TCAD and advanced simulation techniques and studies) although not limited, papers are solicited for the following main topics:

• Compact/SPICE modeling of electronic, optical, organic, and hybrid devices and their IC implementation and interconnection.

• Verilog-A models of the semiconductor devices (including Bio/Med sensors, MEMS, Microwave, RF, High voltage and Power, emerging technologies and novel devices), parameter extraction, reliability and variability, performance evaluation and open source benchmarking/implementation methodologies.

• Modeling of interactions between process, device and circuit design, Design Technology Co-Optimization, Foundry/Fabless Interface Strategies.

• Numerical, analytical, statistical modeling and simulation of electronic, optical and hybrid devices, interconnect, isolation and 2D/3D integration; Aspects of materials, fabrication processes and devices e.g. advanced physical phenomena (quantum mechanical and non-stationary transport phenomena, ballistic transport, …); Mechanical or electro-thermal modeling and simulation; DfM.

• Reliability of materials and devices.

• Design Technology-Co-Optimization.

The deadline for the submission of abstracts is April 19th April 26th and the call for papers can be downloaded here https://www.esscirc-essderc2021.org/call-for-papers

Thierry Poiroux, CEA-LETI (F) - Track3 Chair

Compact Modeling and Process/Device Simulation

https://www.esscirc-essderc2021.org/

[C4P] 32nd MIEL 2021

32nd IEEE International Conference on Microelectronics (MIEL 2021) 

Niš  September 12-14, 2021

This year,  MIEL 2021 will be dedicated to

Professor Ninoslav Stojadinovic, founder of MIEL Conference.

Due to the unprecedented health, travel and social distance restrictions imposed in Serbia and all over the world as a result of the COVID-19 pandemic, all participants will be invited to join a virtual MIEL 2021.

Accepted papers will be published in the Proceedings of the MIEL 2021 Conference, and included in IEEE Xplore database, subject to regular registration of at least one of the authors before July 16th, 2021.

 

We are pleased to invite you, as an expert in the field of microelectronics, to submit a paper to MIEL 2021 Conference and to encourage colleagues to do it.

 

The deadline for the submission of two page-extended summaries (including figures, tables, and references) is May 7th, 2021.

 

Extended versions of selected papers from MIEL 2021 Conference will be published (after the regular review process) in:

Journal of Circuits, Systems and Computers

or

Facta Universitatis, Series: Electronics and Energetics

Looking forward to receiving your abstract for MIEL 2021 Conference, we remain with

 

Best regards,

Vojkan Davidović

Danijel Danković

http://miel.elfak.ni.ac.rs/

Please contact miel@elfak.ni.ac.rs for further information.