EDTM 2021, Chengdu (CN): March 9-12, 2021

EDTM Conference 2021, Chengdu, China, between March 9th to 12th, 2021

Paper Submission Deadline: November 7 2020

	The IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2021 is a four-day meeting to be held in Chengdu, China, during March 9th to 12th, 2021. Sponsored by IEEE Electron Devices Society (EDS), EDTM2021 is a premier conference, providing a unique forum for discussions on a broad range of device/manufacturing-related topics. EDTM2021 starts on Tuesday, March 9, 2021 with Tutorial & Short Courses, followed by three days of Plenary talks and parallel Oral sessions. Joint Poster sessions and Exhibition will be held on the same site. EDTM2021 Theme: Intelligent Technologies for Smart and Connected Life. ▪ Technical Areas EDTM2021 solicits papers in all areas of electron devices, including materials, processes, devices, packaging, modeling, reliability, manufacturing and yield, tools, testing, and any emerging device technologies. EDTM2021 cordially invites authors to submit your papers. Please refer to the EDTM2021 website for more details, or clink links below: EDTM2021 website: https://ewh.ieee.org/conf/edtm/2021/ Call for Papers ▪ Sponsorship & Exhibition EDTM2021 also warmly invites sponsors and exhibitors to participate in and support the conference where you can showcase your new technologies and products to attendees from around the world. Call for Sponsorship Call for Exhibitors ▪ Awards EDTM2021 will select Best Paper Award, Best Student Paper Award and Best Poster Paper Award. ▪ Publications All selected and presented papers will be included in the EDTM2021 Proceedings that will be published at the IEEE Xplore. Selected papers will be invited to submit the extended manuscripts that will be reviewed for possible publication in the IEEE Journals of Electron Devices Society (J-EDS), which is an Open Access journal. ▪ Important Dates Paper Submission Starts August 1, 2020 Paper Submission Deadline November 7 2020   Notification of Acceptance December 20, 2020 EDTM2021 Conference March 9 - 12, 2021 ▪ Location Chengdu, located in southwest of China, is not just the home for Grand Pandas. An emerging technology and business hub full of hi-tech companies from around the world, it is also a trendy city where you will find everything that you could imagine for you to enjoy your leisure time, from the famous Sichuan food to mind-soothing teas to natural scenics to historical wonders. The wonderful city is just an easy flight away from many places around the Globe. ▪ Contacts General Chair: Albert Wang, University of California, Riverside, aw@ece.ucr.edu General Co-Chair: Tianchun Ye, IME-CAS, tcye@ime.ac.cn TPC Chair: Huaqiang Wu, Tsinghua University, wuhq@tsinghua.edu.cn TPC Co-Chair: Subramanian Iyer, University of California, Los Angeles, s.s.iyer@ucla.edu COVID-19 Watch: Chengdu remains safe. EDTM2021 is planned as an in-person/on-site event. Meanwhile, we are closely monitoring the development of global COVID-19 outbreak. A contingency plan will allow virtual presentations and participation for those with travel restrictions and concerns. Both safety and participation experiences will be ensured for EDTM2021. EDTM2021 website: https://ewh.ieee.org/conf/edtm/2021/

 

 

The Future of CERN’s Large Hadron Collider For Humanity a Necessity or a Waste? https://t.co/xzCoofmtBN #semi https://t.co/O7vWjmFloj

The Future of CERN’s Large Hadron Collider For Humanity
a Necessity or a Waste? https://t.co/xzCoofmtBN#semi pic.twitter.com/O7vWjmFloj

— Wladek Grabinski (@wladek60) October 28, 2020

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from Twitter https://twitter.com/wladek60

October 28, 2020 at 11:03AM
via IFTTT

Prof. Michael Shur: IEEE EDS DL - Counter Intuitive Physics of Ballistic Transport in the State-of-the-Art Electronic Devices

To view complete details for this event, click here to view the announcement 

 

The EDS Germany Chapter and NanoP proudly presents Michael Shur from Rennselaer Polytechnic Institute, New York, USA for a Distinguished Lecture on "Counter Intuitive Physics of Ballistic Transport in the State-of-the-Art Electronic Devices". 

Date and Time

• Date: 16 Nov 2020
• Time: 03:00 PM to 04:00 PM
• All times are Europe/Berlin
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Location

The Distiguished Lecture will be held via Zoom. Login information provided before the event and requires registration.

• Virtual
• Germany

Hosts

• Germany Section Chapter, ED15
• Co-sponsored by NanoP, Technische Hochschule Mittelhessen - University of Applied Sciences

Registration

• Starts 28 October 2020 07:00 AM
• Ends 14 November 2020 12:00 AM
• All times are Europe/Berlin
• No Admission Charge

[paper] Optomechanical Sensor in Verilog-A

Houssein Elmi Dawale, Loïc Sibeud, Sébastien Regord, Guillaume Jourdan, Member, IEEE, Sébastien Hentz, Member, IEEE, and Franck Badets, Senior Member, IEEE

Compact Modeling and Behavioral Simulation of an Optomechanical Sensor in Verilog-A

IEEE Transactions on Electron Devices, vol. 67, no. 11, pp. 4677-4681, Nov. 2020

DOI: 10.1109/TED.2020.3024477

Abstract: Previous work has shown that optomechanical resonators are particularly well suited to the design of ultrasensitive mass sensors. They present an extremely low noise level, very high optical quality factor (Q>105), excellent integration density and can resonate both in a gaseous and liquid environment. In order to reduce the long measurement time due to their small particle capture area, several such resonators must be integrated onto the same chip. However, bulky laboratory equipment currently used to read a single optomechanical resonator cannot be practically scaled up to a large array of transducers. It is then required to design and eventually integrate a read-out interface that can process tens to thousands of resonators. To ease the design of such a circuit, this article presents a compact analytical model of an electrostatically actuated optomechanical resonator implemented in Verilog-A. The proposed model includes both the optical and mechanical behaviors, as well as optomechanical coupling and thermo-optical effect. It was simulated in commercial simulator and is consistent with the measured results. 

FIG: a) General view of the optomechanical device with electrostatic actuation. 

b) Functional diagram of the device in Verilog-A.

[book] Ultra-Low Power FM-UWB Transceivers for IoT

Ultra-Low Power FM-UWB Transceivers for IoT

Vladimir Kopta and Christian Enz

River Publishers, 2020, pp.i-xxiv

Over the past two decades we have witnessed the increasing popularity of the internet of things. The vision of billions of connected objects, able to interact with their environment, is the key driver directing the development of future communication devices. Today, power consumption as well as the cost and size of radios remain some of the key obstacles towards fulfilling this vision. Ultra-Low Power FM-UWB Transceivers for IoT presents the latest developments in the field of low power wireless communication. It promotes the FM-UWB modulation scheme as a candidate for short range communication in different IoT scenarios. The FM-UWB has the potential to provide exactly what is missing today. This spread spectrum technique enables significant reduction in transceiver complexity, making it smaller, cheaper and more energy efficient than most alternative options. The book provides an overview of both circuit-level and architectural techniques used in low power radio design, with a comprehensive study of state-of-the-art examples. It summarizes key theoretical aspects of FM-UWB with a glimpse at potential future research directions. Finally, it gives an insight into a full FM-UWB transceiver design, from system level specifications down to transistor level design, demonstrating the modern power reduction circuit techniques. Ultra-Low Power FM-UWB Transceivers for IoT is a perfect text and reference for engineers working in RF IC design and wireless communication, as well as academic staff and graduate students engaged in low power communication systems research.