Accurate semi empirical predictive #model for doped and undoped double gate #DG #MOSFET (Solid-State Electronics Available online 4 August 2018) https://t.co/klJRI2hywk https://t.co/Y3PoUrYO58

Accurate semi empirical predictive #model for doped and undoped double gate #DG #MOSFET (Solid-State Electronics Available online 4 August 2018)
https://t.co/klJRI2hywk pic.twitter.com/Y3PoUrYO58

— Wladek Grabinski (@wladek60) August 13, 2018

from Twitter https://twitter.com/wladek60

August 13, 2018 at 10:02AM
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#FOSDEM 2019 - Call for participation #C4P https://t.co/t7BFGjDvy5 #paper

#FOSDEM 2019 - Call for participation #C4P https://t.co/t7BFGjDvy5 #paper

— Wladek Grabinski (@wladek60) August 11, 2018

from Twitter https://twitter.com/wladek60

August 11, 2018 at 03:35PM
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Physical Insights on #Quantum Confinement and Carrier Mobility in Si, Si0.45Ge0.55, Ge Gate-All-Around #NSFET for #5nm Technology Node - IEEE Journals & Magazine https://t.co/EVcK4twqtW #paper

Physical Insights on #Quantum Confinement and Carrier Mobility in Si, Si0.45Ge0.55, Ge Gate-All-Around #NSFET for #5nm Technology Node - IEEE Journals & Magazine https://t.co/EVcK4twqtW #paper

— Wladek Grabinski (@wladek60) August 10, 2018

from Twitter https://twitter.com/wladek60

August 10, 2018 at 01:32PM
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Why Join an #OpenSource Software #Foundation? - SourceForge Community Blog https://t.co/r9AyUXGnwc

Why Join an #OpenSource Software #Foundation? - SourceForge Community Blog https://t.co/r9AyUXGnwc

— Wladek Grabinski (@wladek60) August 10, 2018

from Twitter https://twitter.com/wladek60

August 10, 2018 at 07:43AM
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Hybrid Systems-in-Foil: Enabler or Flexible Electronics

Presented by: Joachim N. Burghartz

Date: 22 August 2018

Time: 11 AM – 12 PM EDT 

Hybrid Systems-in-Foil: Enabler or Flexible Electronics - Flexible electronics add mechanical flexibility, shape adaptivity and stretchability as well as large-area place ability to electronic systems, thus allowing for conquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large-area devices and ultra-thin silicon chips on flexible substrates is viewed as an enabler to high-performance and reliable industrial solutions as well as to high-end consumer applications of flexible electronics. This talk discusses issues in ultra-thin chip fabrication, device modeling and circuit design, as well as assembly and interconnects for thin chips embedded into foil substrates in which flexible large-area components are implemented for an overall optimized Hybrid System-in-Foil (HySiF).

This message is being sent to you on behalf of Tian-Ling Ren, EDS Education Committee Chair. All participants will receive WebEx details prior to the event. We sincerely hope that you can join us for these special events. Register Now!