Europe-wide plastic microelectronics project

A research group of THM is operating in a Europe-wide joint project on the development of electronic circuits made of plastics. Head of the project at the THM is Prof. Dr. Alexander Klös of the competence center nanotechnology and photonics. Partners are the Spanish Universitat Rovira i Virgili, the École Polytechnique in Palaiseau France and the University of Cambridge in England.

The research projec are also participating two research institutes in France and the Netherlands and three software companies. The European Union funded the project with almost 750,000 euros to promote in particular the exchange of researchers between the participating institutions. 

Organic semiconducting materials allow the production of electronic components by conventional printing methods such as silk screen or offset printing. This alternative is far less powerful than the classic silicon technology. However, it has advantages in certain application fields and is significantly cheaper. When using chip cards or electronic labels the reduced efficiency does not matter. The market research company IDTechEx expects in 2026 a growth of the global market volume for organic electronics from currently 26.5 to 69 billion US dollars [read more...]

#BOOK: Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

 
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology:

 Circuit Design, and Process Technology

 Luciano Lavagno, Igor L. Markov, Grant Martin, Louis K. Scheffer

 CRC Press, 27 Apr 2016 - Technology & Engineering - 786 pages, 2nd Edition

The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, EDA for IC Implementation, Circuit Design, and TCAD thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more.

Recommended book sections:

SECTION II Analog and Mixed-Signal Design

Chapter 17: Simulation of Analog and RF Circuits and Systems (pp.417)

Jaijeet Roychowdhury and Alan Mantooth

Chapter 18: Simulation and Modeling for Analog and Mixed-Signal Integrated Circuits (pp.455)

Georges G.E. Gielen and Joel R. Phillips

Chapter 19: Layout Tools for Analog Integrated Circuits and Mixed-Signal Systems-on-Chip: A Survey (pp.479)

Rob Rutenbar, John M. Cohn, Mark Po-Hung Lin, and Faik Baskaya

SECTION IV Technology Computer-Aided Design

Chapter 27: Process Simulation (pp.691)

Mark Johnson

Chapter 28: Device Modeling: From Physics to Electrical Parameter Extraction (pp.715)

Robert W. Dutton, Chang-Hoon Choi, and Edwin C. Kan

Chapter 29: High-Accuracy Parasitic Extraction (pp.745)

Mattan Kamon and Ralph Iverson

#papers Avalanche Microwave Noise Sources in Commercial 90-nm CMOS Technology https://t.co/pCIGdXmKQ9

#papers Avalanche Microwave Noise Sources in Commercial 90-nm CMOS Technology https://t.co/pCIGdXmKQ9

— Wladek Grabinski (@wladek60) May 7, 2016

from Twitter https://twitter.com/wladek60

May 07, 2016 at 12:43PM
via IFTTT

Will Si SJ MOSFETs maintain their lead over GaN power devices? https://t.co/eEbFw1Mcvk #papers

Will Si SJ MOSFETs maintain their lead over GaN power devices? https://t.co/eEbFw1Mcvk #papers

— Wladek Grabinski (@wladek60) May 4, 2016

from Twitter https://twitter.com/wladek60

May 04, 2016 at 06:58PM
via IFTTT

4th Training Course on Compact Modeling

 4th Training Course on Compact Modeling 

 (TCCM) 

 in Tarragona on June 27-28 2016

The 4th TCCM is partially sponsored by the DOMINO H2020 project. It will consist a series of lectures conducted by prestigious researchers in the field of modeling of semiconductor devices, dealing with several issues related to the semiconductor device modeling, mostly compact/SPICE modeling. It is a very interesting event to PhD students and young researchers, but can interest senior researchers too.

Invited TCCM Lecturers:

• Morgan Madec (Univ of Strasbourg, France): Compact modeling for biological applications
• Mansun Chan (Hong Kong University of Science and Technology): An Integrated Approach for Circuit Performance and Reliability Simulation
• Mohammed Nawaz (ABB Sweden): Static and dynamic characterization of SiC based MOSFETs/IGBTs
• Christoph Jungemann (RWTH-Aachen): TCAD and semiclassical device modeling
• Antonio Cerdeira (CINVESTAV, Mexico): Model parameter extraction techniques
• Fabrizio Torricelli (Univ. of Brescia, Italy): Modelling of Amorphous-Oxide-Semiconductors TFTs for large-area flexible electronics
• Eugenio Cantatore (TU-Eindhoven): Application of compact models for organic circuit design
• Ahmed Nejim (Silvaco): TCAD for compact model development
• Firas Mohammed (Infiniscale): Mathematical and Semi-physical compact modeling for emerging technologies
• Heinz Olaf Müller (Plastic Logic): Device simulation for Organic Electronics using Genius

Besides, on June 29 1016, a Workshop on Flexible Electronics will be organized, too. Attendees to TCCM who work on Flexible Electronics (not necessarily modeling) will have a chance to present recent results on their own. 

Finally, on June 30-July 1 we will organize the Annual Graduate Student Meeting on Electronic Engineering, consisting of plenary talks by prestigious researchers and student presentations. 

[more about DOMINO H2020 project at ww.domino-rise.eu]