Ling Qiao Cai1,2, Bin Yang1,2, Fumin Luo1,2, Chang Liu1,2, WeiGui Guo1,2, GuoRong Zhang1,2, XueFei Liu1,2, Qinglang Guo1,2 and Bin Wu
SPICE-Q and Large-Scale Quantum Chip Production
[quant-ph] 16 Jun 2026
arXiv:2606.17907v1
1.) Yangtze Delta Industrial Innovation Center of Quantum Science and Technology, Suzhou, (CN)
2.) China Academy of Electronics and Information Technology, No. 11 Shuangyuan Road, Shijingshan District, Beijing, (CN)
Abstract: The historical analogy with SPICE is based on foundational reports, numerical methods, and experience from integrated circuit design. The requirements for quantum computing and scaling refer to established work in the field. The background on superconducting qubits, transmons, circuit quantum electrodynamics, microwave networks, material loss, and three‑dimensional interconnects draw from widely recognized literature. The background on parameter extraction, simulation frameworks, and manufacturability is informed by recent research and practical developments.
Table of Contents (Top‑Level Sections)
- Abstract ... p. 4
- The Emergence of SPICE and Large‑Scale Classical Circuits
and Its Implications for Quantum Chips ... p. 5 - SPICE‑Q Model Composition ... p. 24
- SPICE‑Q Device‑Level Models ... p. 40
- Standardized Manufacturing System ... p. 53
- Integrating SPICE‑Q with Process Models ... p. 66
- Design‑Technology Co‑Optimization (DTCO) ... p. 71
- Large‑Scale Production Examples and Design Scenarios ... p. 75
- Engineering Transition and Large‑Scale Quantum Chips ... p. 80
- Summary ... p. 84
- Acknowledgment ... p. 87
- Reference ... p. 87
- Appendix A ... p. 90
Acknowledgment The authors thank Jun Ye for helpful assistance. The authors also acknowledge the use
of AI tools for translation assistance and auxiliary text generation.
