ESSERC 2026 PAPERS SUBMISSION DEADLINE
APRIL 3, 2026
Papers submitted for ESSERC 2026 review must clearly state:
- The purpose of the work
- How and to what extent it advances the state-of-the art
- Specific results and their impact.
Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference. Measurement results or calibration against measured data is required to support the claims of the submitted paper.
ESSERC 2026 Conference Tracks
- Advanced Technology, Process and Materials
- Analog, Power and RF Devices
- Modelling and Simulation of Electron Devices
- Analog Circuits
- Data Converters
- RF & mm‑Wave Circuits
- Frequency Generation Circuits
- Digital Circuits & Systems
- Power Management
- Wireless Systems
- Wireline and Optical Circuits and Systems
- Emerging Computing Devices and Circuits
- Architectures and Circuits for AI and ML
- Devices & Circuits for Sensors, Imagers and Displays
After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by May 27, 2026.
At the same time, the complete program will be published on the conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication. The submitted final PDF files must be IEEE Xplore compliant.
Best Paper Award: Papers presented at the conference will be considered for the “Best Paper Award” and “Best Young Scientist Paper Award”. The selection will be based on the results of the paper selection process and the judgment of the conference participants. The award delivery will take place during ESSERC 2027.
For each paper independently, at least one (co-)author is required to register for the conference (one registration one paper policy). Registration fees and deadlines will be available on the conference website.
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