Second International Symposium on Organic Semiconductor Materials, Devices and Processing

The International Symposium on Organic Semiconductor Materials and Devices (Symposium
E9) will be held during the 216th ECS Meeting in Vienna, Austria. It will be the second
symposium in this series and the objective is to link processing and materials studies to devices
and technological applications. The symposium will cover a wide range of topics related to
broadly understood science and technology of organic/polymeric semiconductor materials,
processes, devices and applications. The list of topics of interests includes, but is not limited to,
the following:

• Chemistry of organic semiconductors and its impact on material and device characteristics;
organic and polymer semiconductors
• Physical phenomena underlying operation of organic/polymeric semiconductor devices
• Deposition methods: PVD, solution processing, printing and others
• Substrates: conductive and non-conductive, mechanically rigid and flexible
• Electronic devices: TFTs; ohmic contacts, dielectric-organic semiconductor material systems,
charge transport, modeling
• Photonic devices: light emitting diodes and solar cells
• Display and lighting applications
• Patterning of organic semiconductors to create desired device geometries
• Large area organic semiconductor electronics and photonics; roll-to-roll processing
• Reliability, stability, reproducibility of device characteristics

a one-page abstract must be
submitted electronically to ECS by 24 April 2009. A copy of the abstract must also be submitted
to the lead symposium organizer Prof. Jamal Deen, and be accompanied by a cover letter with full
contact details of the presenting author. This abstract should clearly indicate the purpose of the
work, the approach, the manner and the degree to which the work advances the field, and specific
results and their significance. All submitted abstracts will be peer-reviewed. Instructions for
preparing ECS meeting abstract and other relevant information are available on the ECS World
Wide Web Home Page at http://www.electrochem.org. Any additional information can be
obtained from the symposium organizers listed below.

M. Jamal Deen, McMaster University, Electrical and Computer Engineering Department (CRL 226), 1280
Main Street West Hamilton, ON L8S 4K1, Canada. Tel: (905) 525-9140 ext. 27137, Fax: (905) 523 4407,
E-mail: jamal@mcmaster.ca

David Gundlach, National Institute of Standards and Technology , Semiconductor Electronics Division
(Bldg. 225, Room A369, M.S. 8120), 100 Bureau Drive, Gaithersburg, MD 20899-8120 USA. Tel: (301)
975-2048; Fax: (301) 975-8069, Email:David.Gundlach@NIST.gov

Benjamin Iñiguez, Department of Electronic Engineering, Universitat Rovira i Virgili, Avda. Països Catalans, 26, 43007 Tarragona-Spain. Tel: +34 977 558 521, Fax: +34977559605, Email:
benjamin.iniguez@urv.cat

Hagen Klauk, Max Planck Institute for Solid State Research, Heisenbergstr. 1, 70569 Stuttgart, Germany.
Tel: +49 711 689-1401; Fax: +49 711 689-1472; E-mail: H.Klauk@fkf.mpg.de

7th IEEE EWDTS SYMPOSIUM

The main target of the IEEE East-West Design & Test Symposium (EWDTS 2009) is to exchange experiences between the scientists and technologies of the Eastern and Western Europe, as well as North America and other parts of the world, in the field of design, design automation and test of electronic systems. The symposium aims at attracting scientists especially from countries around the Black Sea, the Baltic states and Central Asia.

Symposium Deadlines:

• Submission deadline: May 30th, 2009
• Notification of acceptance: August 1st, 2009

Please go to http://www.molesystems.com/welcome/tttc/EWDTS/2008/login.php to submit your paper.

Olympics of semiconductors

"Olympics of semiconductors!" ISSCC 2009 was held in San Francisco, California from Feb 8 to 12, 2009 with more papers form Asia.

(source: Nikkei Electronics Asia -- April 2009)

“Living with Variability” - Are You Ready?

• How to understand and manage variability impact at 45nm and below?
• What impact does variability have on interfacing the Foundry?
• How will the industry characterise and model variability?

answers: Living with Variability: 12th & 13th May 2009. Savoy Place, London

36th Birthday Party for SPICE

SPICE (“Simulation Program with Integrated Circuit Emphasis”) was announced to the world on April 12, 1973. So, in honor of SPICE’s thirty-sixth “birthday”, here is a link to the first of several interactive posts about how SPICE works:

http://signal-integrity-tips.com/2009/circuit-simulation-part-one-spice-turns-thirty-six/