Fwd: Call for Papers: ICAEEET-2022

 CALL FOR PAPERS

 International  Conference  on  Advancement  in Electrical & Electronics Engineering and Technology (ICAEEET-2022)

Mode of Conference - Online

November 10-11, 2022

Bansal Institute of Engineering and Technology

Lucknow, Uttar Pradesh, India

Technically Associated With

IEEE UP Section

Greetings from Bansal IET, Lucknow.

It is a matter of immense pleasure to inform you that the Department of Electrical Engineering, Bansal Institute of Engineering and Technology, Lucknow is going to organize the International  Conference  on Advancement  in Electrical & Electronics Engineering and Technology (ICAEEET-2022) during November 10-11, 2022. International  Conference  on  Advancement  in Electrical & Electronics Engineering and Technology (ICAEEET) focused  on  advancement in electrical and electronics engineering and interdisciplinary research in  computer,  instrumentation,  automation,  and communication engineering.  ICAEEET aims to bring together researchers, scientists, engineers, scholars and students to exchange and share their experiences, new ideas,  and  research  results.  This  conference  is  about various  aspects  of  engineering,  discussion  on  the practical  challenges  encountered  and  the  solutions adopted.  Expert  talks  are  planned  for  exchange  of ideas and sharing expertise. The conference serves to be a better  platform  to  enrich  research  activities.

The conference website is available at: https://icaeeet.wordpress.com/

We request you to please submit your work and kindly encourage your colleagues, research scholars and students to share their research papers at ICAEEET-2022.

The deadline for paper submission is September 27, 2022 .

Submission portal: https://easychair.org/conferences/?conf=icaeeet2022

We look forward to your participation and support.

 

-- With regards -- ICAEEET-2022 Organizing Committee

Micro-Transfer-Printing to be held in Erfurt, Germany, on November 21 & 22, 2022. Register today at: https://t.co/5Dq6B2ZUk6 #semi #microtransferprinting #3Dintegration #heterogenousintegration #advancedpackaging #Erfurt https://t.co/UqTwBCdAnj

Micro-Transfer-Printing to be held in Erfurt, Germany, on November 21 & 22, 2022. Register today at: https://t.co/5Dq6B2ZUk6 #semi #microtransferprinting #3Dintegration #heterogenousintegration #advancedpackaging #Erfurt https://t.co/UqTwBCdAnj

— Wladek Grabinski (@wladek60) Sep 15, 2022

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from Twitter https://twitter.com/wladek60

September 15, 2022 at 08:47AM
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Future Horizons Semiconductor Industry Update Webinar

Has the chip market boom come to an end? What fate now awaits the industry? Find out the answer to these and other key questions at Future Horizons' IFS2022 Mid-Term Semiconductor Industry Update Webinar, Sep 13, 2022 - 3pm UK BST (GMT+1):

https://www.futurehorizons.com/page/136/Industry-Update-Webinar

Why? Founded in 1989, Future Horizons’ track record and industry experience makes this a must-attend event for key decision makers in the semiconductor, electronics and all related industries. We always present accurate and insightful analysis at these events backed up by sound data

What You Will Learn: This one-hour broadcast will focus on the chip industry outlook, including:
• Has the market boom turned to bust
• What is the market outlook for 2023
• What are the exposures, vulnerabilities, opportunities, losers and gainers
• What will the likely downturn repercussions be
• How to build resilient strategies and business models
• Opportunity to ask specific questions in advance, during and after the webinar.

Who Should Attend?
• All companies, small and large, from startups to established market leaders
• Key decision-makers engaged in the design, manufacture, or supply of semiconductors
• Government organisations involved in trade and investment
• Those involved in investing or banking within the electronics industry
• Senior marketing executives planning future marketing strategy

Why Future Horizons?

We have been in the business of forecasting and analysing the semiconductor market for over 55 years and have been a trusted advisor to governments, investors and most of the top global semiconductor firms. Time and time again, we have delivered sound advice and saved our clients time and money with our forensic and accurate analysis of the industry.

Malcolm Penn; Chairman & CEO; Future Horizons Registered Company: 4380991

Future Horizons on Social Media
Follow FH on Twitter, like FH on Facebook and join FH Linked In Group and receive regular industry news, information and comments.

Handbook of Semiconductor Devices

Massimo Rudan, Rossella Brunetti, Susanna Reggiani (Eds.)

Springer Handbook of Semiconductor Devices

Series: Springer Handbooks

1st ed., 2022, ca. 1700 p., 1300 illus.

Order online at link.springer.com or customerservice@springernature.com

• Covers physical backgrounds, fabrication, application and modeling
• Describes in detail both conventional and innovative devices
• An indispensable resource for practitioners, professionals and researchers

This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications.

Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers.

Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances.

Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in. specific subject can easily identify personal reading path through the vast contents of the handbook.

Technological aspects

CMOS Manufacturing processes. Semiconductor memory technologies. BCD process technologies. Measuring techniques for the semiconductor's parameters. Interconnect Processing: Integration, Dielectrics, Metals. Wet Chemical Processes for BEOL Technology. From FinFET to nanosheets and beyond. Advanced Lithography. Advanced technologies for future materials and devices

Basic devices and applications

MOS Capacitors, MOS Transistors and Charge-Transfer Devices. Electrostatic doping and devices. Planar MOSFETs and their application to IC design. Silicon power devices. Silicon Carbide Power Devices. GaN- based lateral and vertical devices. Bipolar transistors and silicon diodes. Memory Challenges. Silicon sensors. Solar Cells. X-ray detectors. Photodetectors based on Emerging Materials. Terahertz Electronic Devices. Semiconductor Lasers

New-generation devices and architectures

Heterojunction tunnel field-effect transistors. Carbon based field-effect transistors. Negative capacitors and applications. Flexible Electronics and Biomedical Sensors. Bio-Degradable Electronics. Resistive Switch- ing Memories. Phase-Change Memories. Spin-Based Devices for Digital Applications. Memristive/CMOS devices for neuromorphic applications. Nanoelectronic Systems for quantum computing

Modeling

Compact/SPICE Modeling. Process simulation. A digital twin for MEMS and NEMS. Macroscopic Transport Models for Classical Device Simulation. Grid generation and Algebraic solvers. Spherical Harmonics Expansion and Multi-Scale Modeling. Charge Transport Models for Amorphous Chalcogenides. Application of the k.p method to device simulation. Ab initio methods for electronic transport in semiconductors and nanostructures. Quantum Transport in the Phase Space, the Wigner Equation. The Non-Equilibrium Green Function (NEGF) Method. Tight-Binding Models, their Applications to Device Modeling and Deployment to. Global Community

[Steven Kosier] Google, National Institute of Standards and Technology (NIST), and SkyWater Technology Foundry bring wafer-level economies of scale to materials and device research through this CRADA! #madeinamerica #freePDK #semi https://t.co/oI71mlHwfD

[Steven Kosier] Google, National Institute of Standards and Technology (NIST), and SkyWater Technology Foundry bring wafer-level economies of scale to materials and device research through this CRADA!  #madeinamerica #freePDK #semi https://t.co/oI71mlHwfD

— Wladek Grabinski (@wladek60) Sep 14, 2022

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from Twitter https://twitter.com/wladek60

September 14, 2022 at 09:20AM
via IFTTT