Sep 15, 2022

Micro-Transfer-Printing to be held in Erfurt, Germany, on November 21 & 22, 2022. Register today at: https://t.co/5Dq6B2ZUk6 #semi #microtransferprinting #3Dintegration #heterogenousintegration #advancedpackaging #Erfurt https://t.co/UqTwBCdAnj



from Twitter https://twitter.com/wladek60

September 15, 2022 at 08:47AM
via IFTTT

Sep 14, 2022

Future Horizons Semiconductor Industry Update Webinar

Has the chip market boom come to an end? What fate now awaits the industry? Find out the answer to these and other key questions at Future Horizons' IFS2022 Mid-Term Semiconductor Industry Update Webinar, Sep 13, 2022 - 3pm UK BST (GMT+1):
https://www.futurehorizons.com/page/136/Industry-Update-Webinar


Why? Founded in 1989, Future Horizons’ track record and industry experience makes this a must-attend event for key decision makers in the semiconductor, electronics and all related industries. We always present accurate and insightful analysis at these events backed up by sound data

What You Will Learn: This one-hour broadcast will focus on the chip industry outlook, including:
• Has the market boom turned to bust
• What is the market outlook for 2023
• What are the exposures, vulnerabilities, opportunities, losers and gainers
• What will the likely downturn repercussions be
• How to build resilient strategies and business models
• Opportunity to ask specific questions in advance, during and after the webinar.

Who Should Attend?
• All companies, small and large, from startups to established market leaders
• Key decision-makers engaged in the design, manufacture, or supply of semiconductors
• Government organisations involved in trade and investment
• Those involved in investing or banking within the electronics industry
• Senior marketing executives planning future marketing strategy

Why Future Horizons?
We have been in the business of forecasting and analysing the semiconductor market for over 55 years and have been a trusted advisor to governments, investors and most of the top global semiconductor firms. Time and time again, we have delivered sound advice and saved our clients time and money with our forensic and accurate analysis of the industry.

Malcolm Penn; Chairman & CEO; Future Horizons Registered Company: 4380991

Future Horizons on Social Media
Follow FH on Twitter, like FH on Facebook and join FH Linked In Group and receive regular industry news, information and comments.



Handbook of Semiconductor Devices

Massimo Rudan, Rossella Brunetti, Susanna Reggiani (Eds.)
Springer Handbook of Semiconductor Devices
Series: Springer Handbooks
1st ed., 2022, ca. 1700 p., 1300 illus.

Order online at link.springer.com or customerservice@springernature.com
  • Covers physical backgrounds, fabrication, application and modeling
  • Describes in detail both conventional and innovative devices
  • An indispensable resource for practitioners, professionals and researchers



This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications.

Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers.

Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances.

Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in. specific subject can easily identify personal reading path through the vast contents of the handbook.

Technological aspects
CMOS Manufacturing processes. Semiconductor memory technologies. BCD process technologies. Measuring techniques for the semiconductor's parameters. Interconnect Processing: Integration, Dielectrics, Metals. Wet Chemical Processes for BEOL Technology. From FinFET to nanosheets and beyond. Advanced Lithography. Advanced technologies for future materials and devices

Basic devices and applications
MOS Capacitors, MOS Transistors and Charge-Transfer Devices. Electrostatic doping and devices. Planar MOSFETs and their application to IC design. Silicon power devices. Silicon Carbide Power Devices. GaN- based lateral and vertical devices. Bipolar transistors and silicon diodes. Memory Challenges. Silicon sensors. Solar Cells. X-ray detectors. Photodetectors based on Emerging Materials. Terahertz Electronic Devices. Semiconductor Lasers

New-generation devices and architectures
Heterojunction tunnel field-effect transistors. Carbon based field-effect transistors. Negative capacitors and applications. Flexible Electronics and Biomedical Sensors. Bio-Degradable Electronics. Resistive Switch- ing Memories. Phase-Change Memories. Spin-Based Devices for Digital Applications. Memristive/CMOS devices for neuromorphic applications. Nanoelectronic Systems for quantum computing

Modeling
Compact/SPICE Modeling. Process simulation. A digital twin for MEMS and NEMS. Macroscopic Transport Models for Classical Device Simulation. Grid generation and Algebraic solvers. Spherical Harmonics Expansion and Multi-Scale Modeling. Charge Transport Models for Amorphous Chalcogenides. Application of the k.p method to device simulation. Ab initio methods for electronic transport in semiconductors and nanostructures. Quantum Transport in the Phase Space, the Wigner Equation. The Non-Equilibrium Green Function (NEGF) Method. Tight-Binding Models, their Applications to Device Modeling and Deployment to. Global Community

[Steven Kosier] Google, National Institute of Standards and Technology (NIST), and SkyWater Technology Foundry bring wafer-level economies of scale to materials and device research through this CRADA!  #madeinamerica #freePDK #semi https://t.co/oI71mlHwfD



from Twitter https://twitter.com/wladek60

September 14, 2022 at 09:20AM
via IFTTT

Sep 4, 2022

[mos-ak] [online publications] Recent MOS-AK Workshops


The MOS-AK Association has organized two subsequent compact/SPICE modeling workshops, its selected MOS-AK presentations with assigned DOI Numbers are available online:
The MOS-AK Association plans to continue its standardization efforts by organizing future compact modeling meetings, workshops and panels around the globe thru the 2022 Year, including:
  • IRPhE'2022, Yerevan (AM) Sept. 27-30, 2022
  • MOS-AK Brazil Panel (BR), Oct. 2022
  • 15th US MOS-AK Workshop, Silicon Valley (US) Dec. 2022
    • in the timeframe of CMC and IEDM Meetings
W.Grabinski on the behalf of International MOS-AK Committee
WG040922



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