Jun 23, 2021

EAI ICCASA 2021 Accepting Papers

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October 28 - 29, 2021
Original Location: Ho Chi Minh City, Vietnam
Submission Deadline: July 6, 2021 (extended)

EAI ICCASA 2021 will be held as a fully-fledged online conference (with an on-site possibility). Participate online and join the conference from wherever you are located!

Get the same full publication and indexing, enjoy EAI's fair evaluation and recognition, present your paper to a global audience, and experience virtual meetings live as well as on-demand from the safety and comfort of your home.

Find out what EAI conference live streams look like and discover unique benefits that online participation brings you - learn more.

If the local situation allows it, the event will take place in its original location with an option for all authors to present remotely. In any case, all matters related to publication and indexing will remain unchanged.

SCOPE

- EAI ICCASA celebrates its 10th anniversary -

ICCASA 2021 is a place for highly original ideas about how Context-Aware Systems (CAS) are going to shape networked computing systems of the future. Hence, it focuses on rigorous approaches and cutting-edge solutions which break new ground in dealing with the properties of context-awareness. Its purpose is to make a formal basis more accessible to researchers, scientists, professionals and students as well as developers and practitioners in ICT by providing them with state-of-the-art research results, applications, opportunities and future trends.

We are pleased to invite you to submit your paper to EAI ICCASA 2021. Submissions should be in English, following the Springer formatting guidelines (see Submission). 

Submit Paper

Read moreCall for Papers

Watch the full recording of the EAI ICCASA & ICTCC 2020 livestream
and get involved in this edition! 

Publication

- ICCASA and ICTCC authors have enjoyed over 103.000 downloads -

All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.

ICCASA proceedings are indexed in leading indexing services, including Ei Compendex, Web of Science, Scopus, CrossRef, Google Scholar, DBLP, as well as EAI's own EU Digital Library (EUDL).

Authors of selected papers will be invited to submit an extended version to:

All accepted authors are eligible to submit an extended version in a fast track of:

Additional publication opportunities:

Important dates

Full Paper Submission Deadline: July 6, 2021 (extended)

Notification Deadline: August 4, 2021

Camera-ready deadline: August 30, 2021

Conference dates: October 28 - 29, 2021

KEYNOTE SPEAKERS

De Montfort University, United Kingdom

Title: The Calculus of Context-aware Ambients

Watch Prof. Siewe's
keynote invitation


University of Kassel, Germany

Title: Situational Cooperation of Cyber-Physical Agents for Resilient Smart Cities

Watch Prof. Geihs'
keynote invitation

University of Lahore, Pakistan

Title: Contextual Defeasible Reasoning Formalisms for Heterogeneous knowledge Sources

Collocated with Ictcc 2021!
We are happy to inform you about the collocated conference ICTCC 2021!
This year, the ICTCC conference runs three workshops!
For more information, see here: 
DVIS
ORGANIZING COMMITTEE

General Chair
Phan Cong Vinh - Nguyen Tat Thanh University, Vietnam

Technical Program Committee Chair
Abdur Rakib - The University of the West of England, UK

Meet the full Organizing committee and the Technical Program Committee.

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Credits counting towards your EAI Index, membership ranks and global recognition.
Receive invaluable real-time feedback on your presentation via EAI Compass.

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4th MicDAT '2021: Deadline extension



4th International Conference on Microelectronic Devices
and Technologies (MicDAT '2021)

Corfu Holiday Palace, Corfu, Greece, 27-29 October 2021

https://micdat-conference.com/



Dear Colleague !


In order to fit in with the needs of large number of situations in many universities and numerous requests, I would like inform you kindly that the deadline for 2-page abstracts for the 4th International Conference on Microelectronic Devices and Technologies (MicDAT '2021) has been extended up to 5 July 2021. 


The conference abstract/paper template with instructions for authors is available at:

https://www.micdat-conference.com/author-guide.html


Greece and many other European countries are re-opening in this Summer. Please see more details and current requirements at: https://reopen.europa.eu/en


Accepted vaccines in Greece are: Pfizer BioNtech, Moderna, Astra Zeneca/Oxford, Novavax, Johnson + Johnson/Janssen, Sinovac Biotech, Gamaleya (Sputnik), Cansino Biologics, Sinopharm.


For attendees, who may encounter travel difficulties for any reason, we will organize some online sessions with live stream presentations in Zoom or pre-recorded slides or video presentations with translations on a big screen in the conference room.



About Corfu


Corfu (or Kerkyra) is one of the most beautiful Greek island. It is situated in the Ionian Sea, defined by rugged mountains and a resort-studded shoreline. Its cultural heritage reflects years spent under Venetian, French and British rule before it was united with Greece in 1864. The island runs approximately 64 km long, with greatest breadth at around 32 km. Corfu's coastline spans 217 kilometres including capes its highest point is Mount Pantokrator (911 m) and the second Stravoskiadi, at 849 m.



How to get to Corfu ?


By Plane: Corfu 'Ioannis Kapodistrias' Airport (CFU) is served by several airlines. Year-round both Aegean and Olympic airlines have flights from Athens International Airport (ATH) connecting Corfu Airport. Also Sky Express flies from and to Corfu, from Preveza and several other islands such as Kefalonia, Zakinthos, Kithyra and Heraklion. In the high season (roughly easter through October), other airlines including German Wings, Easyjet, Air Berlin, TuiFly, LTU, Ryanair, Transavia and Wizzair serve the island.


By Boat: Direct Ferry links exist to/from Venice, Ancona, Bari, Brindisi (Italy), Himara and Saranda (Albania) and Igoumenitsa, Patra (Greece).




Call for Papers

Topics of interest (but not limited):


• Analog, digital, mixed, and RF circuits and related design methodologies

• Analog-to-Digital Converters (ADC)

• Voltage-to-Frequency Converts (VFC)

• Frequency-to-Digital Converters (FDC)

• Time-to-Digital Converters (TDC)

• Semiconductor Devices: physics and technology

• Circuit Theory and Applications

• Active and Passive Electronic Components

• Logic, architectural, and system level synthesis

• Nonlinear circuits

• Microprocessors, microcontrollers and DSPs

• Testing, design for testability, built-in self-test

• Area, power, and thermal analysis and design

• Mixed-domain simulation and design

• Embedded systems, low-power designs

• VLSI Circuit and Systems design

• Non-von Neumann computing and related technologies and circuits

• Design and test of high complexity systems integration

• SoC, MPSoC, NoC, SIP, and NIP design and test

• Process technologies, CMOS, BJT, BiCMOS, GaAs

• 3-D integration design and analysis

• Emerging device technologies and circuits, such as FinFETs, SETs, spintronics,
  SFQ, MTJ, etc.

• Design for Manufacturability/Technology Optimization/Yield & Quality

• Microelectronics processing and materials

• Semiconductor processing

• Modern electronics materials

• Solid-state electronics

• Quantum electronics

• Thin solid films

• Nanoprocessing, nanotechnology and nanofabrication

• Nanoelectronics and Spintronics

• Flexible and stretchable electronics

• MEMS, MOEMS and NEMS

• Computer-Aided Design (CAD) of Integrated Circuits

• Hardware/software co-design

• Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs

• Electronic materials science and technology

• Electronics Cooling and Thermal Control

• Optoelectronics

• Organic electronic materials and devices

• Microelectronics reliability and qualification

• Assembly and Packaging



Contribution Types:

Keynote and invited presentations
• Industrial presentations

• Plenary presentations
• Regular presentations
• Posters


Publications (One event three publications !):


1) All registered abstracts will be published in the conference proceedings (USB flash drive edition of published Proceedings with the ISBN), distributed during the conference and submitted for indexing to the Web of Science. The previous MicDAT Conference Proceedings are indexed by the Conference Proceedings Citation Index (CPCI), Web of Science by Clarivate Analytics (formerly known as Thomson Reuters).


2) Authors will be invited to submit full-page extended papers to the special issue of Sensors & Transducers open access journal (ISSN 2306-8515, e-ISSN 1726-5479) for free of charge or in Micromachines (ISSN 2072-666X) - a peer-reviewed open access journal on micro/nano-scaled structures, materials, devices, systems as well as related micro- and nanotechnology from fundamental research to applications. The journal is indexed in EI, Scopus, PubMed and Web of Science, and has an Impact Factor of 2.523 (2019).


3) The limited number of full-page papers published in the journal will be selected by the Editorial Board to extend for book chapters for the open access Book Series on 'Advances in Microelectronics: Reviews', Vol. 4. This open access Book Series is indexed in Book Citation Index (Wed of Science) by Clarivate Analytics.



Extended Deadlines:


Submission (2-page extended abstract): 5 July 2021

Notification of acceptance: 25 July 2021

Registration: 20 September 2021

Camera ready (4-6 page paper): 10 October 2021


More details are available on the conference web site:

https://micdat-conference.com/


Hope to see you in Corfu !



With best wishes,

Sincerely,


Prof., Dr. Sergey Y. Yurish,

MicDAT' 2021 Conference Chairman,

IFSA President

E-mail: micdat (at) sensorsportal (dot) com


Attention ! To be unsubscribed from the Call for Papers is very easy (see the web link below), but you will not get any invitations for keynote and invited presentations, joint research projects, grants, calls for book chapters and papers, etc. any more in the future. Please think twice before unsubscribe.


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Jun 22, 2021

The decline of #Japan’s once-formidable #chip industry shows how quickly tech tides can turn https://t.co/8SNrpRbHqZ #semi https://t.co/1PiPxycFPd



from Twitter https://twitter.com/wladek60

June 22, 2021 at 06:07PM
via IFTTT

#Japan Needs #Billions Now to Stem #Chip Decline, Top Advisor Warns



from Twitter https://twitter.com/wladek60

June 22, 2021 at 10:51AM
via IFTTT