James D. Meindl, master of integrated circuits, dies at 87

Meindl was a visionary engineer who saw the potential of integrated circuits and was an early proponent of an interdisciplinary approach to engineering research [read more by Andrew Myers]

In 1984, electrical engineering professors James D. Meindl (right) and John Hennessy (center) brainstorm with research engineer John Shott about the MIPS project, which simplified computers with RISC architecture. (Image credit: Chuck Painter / Stanford News Service)

Solid-State Electronics Editorial Board

Solid-State Electronics Editorial Board

DOI: 10.1016/S0038-1101(20)30401-9

FOUNDING EDITOR

Dr W. Crawford Dunlap

EDITORS

Enrique Calleja

Dept. of Electronic Engineering (ISOM), 

ETSI Telecommunication,

Universidad Politécnica de Madrid 

(UPM), 28040 Madrid, Spain

Sorin Cristoloveanu 

Grenoble INP, Ref: LPCS-SSE, 46 av. Felix Viallet, 

F-38031 Grenoble Cedex 1, France

Kuniyuki Kakushima

Tokyo Institute of Technology, Midori-ku, Yokohama, Japan

Alexander Zaslavsky

Solid State Electronics, Brown University Engineering, 

182 Hope Street, Providence, RI 02912, USA

EDITORIAL ADVISORY BOARD

• G. Baccarani, Bologna, Italy
• J. Chennupati, Australian National University, Canberra, Australia 
• L. Colombo, Dallas, TX, USA
• G. Ghibaudo, Grenoble, France
• S. Hall, Liverpool, UK
• T. Hashizume, Saitama, Japan
• R. Huang, Peking University, Beijing, China
• S. Hwang, Yongin-si, Gyeonggi-do, South Korea
• S. Keller, Santa Barbara, CA, USA
• J.-H. Lee, Gwanag-Gu, Seoul, South Korea
• C. McAndrew, Tempe, AZ, USA
• J.-M. Sallese, EPFL, Switzerland
• J. Schmitz, Enschede, Netherlands
• A. Seabaugh, Notre Dame, IN, USA
• M. S. Shur, Troy, NY, USA
• A. Waag, Braunschweig, Germany
• H. Wong, City University of Hong Kong, Kowloon, Hong Kong

Incize Newsletter (Q4-2020)

on research & development at Incize   Incize currently has 7 ongoing research projects. The research projects revolve around materials and innovative characterization techniques to serve the 5G technologies and beyond. Take a look at two projects: Porous Silicon and Contactless Measurements. Porous Silicon Pre-processed and Post-processed (Incize's solution) porous silicon integration. From research and development to prototyping, we customise it to fit your application needs. Check out our porous services here. Contactless Measurements Incize is working towards contactless measurements to enable quick characterization with a dedicated research project. After two years of R&D in Phase 1, Phase 2 has just kicked off with the funds of the Walloon Region and cooperation with the 'haute école de la province de Liège'. Want to co-develop a R&D project? Our experts are here for you. Contact us Incize interview - SOI Industry Consortium Interview with SOI Industry Consortium 5G is imminent. Incize researches new materials, and how to respond to new challenges in design and characterization for 5G communication systems/technologies, and beyond.  Mostafa Emam, founder and CEO of Incize talks about how the company is getting ready for 5G in an interview for SOI Industry Consortium. Read the article here. Meet our new team member - Romain Meet Romain In October 2020, Romain Tuyaerts joined Incize as a senior engineer. Romain is now part of the process team, his current research interests include micro-fabrication techniques, and the integration of porous silicon in various applications such as RF microelectronics.   Romain received his master degree in physical engineering, with an orientation in nanotechnologies.  He continued with a PhD in materials science at UCLouvain, obtained in 2018, focused on the coupling between micro-structure, mechanical, optical, and electrical properties of transparent conductive oxides deposited by reactive sputtering. Visit Incize website, now

[Reuters] Joined EU Forces to Invest in Processors and #semi Technologies

[Reuters] Germany, France, Spain and ten other #EU countries have joined forces to invest in processors and #semi technologies, key to internet-connected devices and data processing, in a push to catch up with the United States and Asia. The signatories include Belgium, Croatia, Estonia, Finland, Greece, Italy, Malta, the Netherlands, Portugal and Slovenia. 

 

https://t.co/5eQORq9B8B pic.twitter.com/Ttro1mNKea

— Wladek Grabinski (@wladek60) December 8, 2020

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from Twitter https://twitter.com/wladek60

December 08, 2020 at 10:58AM
via IFTTT

How hot is the #180nm node today?

How hot is the #180nm node today? https://t.co/tZMSU0L4kf #semi pic.twitter.com/72NoDFodx4

— Wladek Grabinski (@wladek60) December 7, 2020

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from Twitter https://twitter.com/wladek60

December 07, 2020 at 10:09AM
via IFTTT