[paper] Quasi-Fermi-Based Charge Transport Scheme for Device Simulation in Cryogenic

Quasi-Fermi-Based Charge Transport Scheme for Device Simulation 

in Cryogenic, Wide-Band-Gap, and High-Voltage Applications

Zlatan Stanojevic, Senior Member, IEEE, Jose Marıa Gonzalez-Medina, Member, IEEE, 

Franz Schanovsky, Member, IEEE, Markus Karner, Member, IEEE

TechRxiv. Preprint (2022) 

DOI:10.36227/techrxiv.21132637.v2 

Abstract: We present a novel approach to solving the transport problem in semiconductors. We reformulate the drift-diffusion equations in terms of the quasi-Fermi-energies as solution variables; a drastic increase in numerical stability is achieved, which permits the simulation of devices at cryogenic temperatures as well as wide-band-gap devices using double precision arithmetic, instead of extended precision arithmetic which would otherwise be required to solve these applications using regular drift-diffusion.

FIG: MOSFET transfer characteristics from 300K down to 4K simulated using FVM/SG/QFT at VDS=0.8V; despite only relying on double precision arithmetic, FVM/SG/QFT is capable of calculating contact currents down to 1e-310A.

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Papers Submission at Custom Integrated Circuits 2023

Dear Friends of the Electronics and Custom-Integrated Circuits Design comunity,

Many of our members do Volonteer for the IEEE Custom-Integrated Circuits Conference (CICC). Custom-Integrated Circuits is a strong point of our Academic and Industry landscape. The call for paper is due by 14th of November but is likely to be extended by another 2 weeks. CICC is one of the flagship conference of our professional societies, with a nice impact score (~3), which is a great opportuinity to showcase your research and recent Devellopments.

Topic of interest includes :

1. Analog Circuits and Techniques
2. Data Converters
3. Digital Circuits, SoCs, and Systems
4. Emerging Technologies, Systems, and Applications
   • Next-generation technology and sensors
   • Biomedical circuits, systems, and applications
5. Foundation of System Design
6. Power Management
7. Wireless Transceivers and RF/mm-Wave Circuits and Systems
8. Wireline and Optical Communication Circuits and Systems 

The detailed call for paper is available online.

We are look forward to receiving contribution from the Switzerland section member through the regular paper submission channels.

Sincerly,

Prof. Taekwang Jang (Solid State Circuit Society Chapter Chair)

Prof. Shih-Chii Liu (Circuit and System and Electron Device Society Joint Chapter Chair)

Switzerland Section : https://ieee.ch/

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