Feb 21, 2022

MIXDES paper submission deadline extended: March 15th, 2022

Dear Colleagues,

I would like to remind you about the upcoming MIXDES 2022 regular paper submission deadline.

As current COVID pandemic situation is quite optimistic and hopefully better within next months, we want to organize the conference on-site in the of the most beautiful cities of Poland – Wroclaw.

To help you with preparation of excellent papers, we have decided to move the submission deadline to 15 March 2022. If you are going to contribute, I encourage you to register your paper just now providing its data and uploading the paper file later. You will be able to update the paper details and the document file at any time till the final paper version deadline (May 13th, 2022). The early submission will allow us to take care of your paper just now, especially start the reviewer assignments and begin the formatting verification process.

To submit the paper, you need to log on to the MIXDES Conference web site (www.mixdes.org) and follow the link "Submit a paper". After successful paper registration, you should receive a confirmation e-mail and the paper should appear in the "User home" page. From this page, you may later update already registered papers.

As in the previous year, we are going to give you an opportunity to publish extended versions of your conference papers in the journal. The information about the post MIXDES publication will be provided soon at the conference site (www.mixdes.org).

Taking the opportunity, I would like to remind all MIXDES 2021 authors that the deadline for Energies submissions passes on 01 July 2022.

Important dates:
  • Paper submission deadline: 15 March 2022
  • Notification of acceptance: 30 April 2022
  • Final paper versions: 13 May 2022
  • Conference days: 23-25 June 2022
If you have any questions, please do not hesitate to contact me.

With best regards,
Mariusz Orlikowski
MIXDES 2022 Conference Secretary

 



 

[mos-ak] [Announcement] Q1 2022 MOS-AK Panel: Compact Model Verilog-A standardization and implementation


The Extended MOS-AK Committee, would like to invite you to a very first MOS-AK Panel to discuss the FOSS EDA tools for the compact/SPICE modeling and its Verilog-A standardization and implementation. The Q1 2022 MOS-AK Panel will be organized as the virtual/online event on Feb.25, 2022.

Upcoming online MOS-AK Panel aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization. The discussion topics cover the important aspects of compact model development, implementation, deployment and standardization, focusing on the FOSS EDA tools support. The Panel will be moderated by the Xyce team members, and we are also expecting proactive participation of the GnuCap, ngspice, as well as Qucs teams. All other compact modeling teams and FOSS EDA software developers are more than welcome to join us!

Online MOS-AK Panel Registration Form:
https://forms.gle/o19AeYeDzMnyLKU79
Registered participants will receive online meeting invitation 24h before the event.
(any related enquiries can be sent to panel@mos-ak.org)

Important Dates: 
  • MOS-AK Panel: Feb.25, 2022 
    • 5:00pm - 7:00pm (CET)
-- W.Grabinski for Extended MOS-AK Committee
WG210222





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Feb 11, 2022

[paper] Cantilever with Carbon Piezoresistor

Jongmoon Jang, Giulia Panusa, Giovanni Boero and Juergen Brugger 
SU-8 Cantilever with Integrated Pyrolyzed Glass-Like Carbon Piezoresistor
Microsyst Nanoeng 8, 22 (2022)
DOI:10.1038/s41378-022-00351-9

Abstract: Glass-like carbon (GC) is a nongraphitizing material composed entirely of carbon atoms produced from selected organic polymer resins by controlled pyrolysis in an inert atmosphere. The GC properties are a combination of the properties of glass, ceramic, and graphite, including hardness, low density, low thermal conductivity, high chemical inertness, biocompatibility, high electrical conductivity, and microfabrication process compatibility. Despite these unique properties, the application of GC in mechanical sensors has not been explored thus far. Here, we investigate the electrical, structural, and chemical properties of GC thin films derived from epoxy-based negative photoresist SU-8 pyrolyzed from 700 to 900°C. In addition, we fabricated microGC piezoresistors pyrolyzed at 700 and 900 °C and integrated them into nonpyrolyzed SU-8 cantilevers to create microelectromechanical systems (MEMS) mechanical sensors. The sensitivities of the GC sensor to strain, force, surface stress, and acceleration are characterized to demonstrate their potential and limits for electromechanical microdevices.

Fig: Design and layout of the glass-like carbon (GC)-based sensor:
a.) Schematic drawing of the GC strain sensor, and
b.) Enlarged optical microscopic image of a fabricated GC piezoresistor

Acknowledgements: The authors thank the Center of Micro/Nanotechnology (CMi) of EPFL for the microelectromechanical system (MEMS) fabrication support and Bio-Micro Robotics laboratory with Professor Hongsoo Choi of DGIST for the microforce probe system facility support. This work received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation program (Project “MEMS 4.0”, ERC-2016-ADG, Grant Agreement No. 742683) and the National Research Foundation of Korea (NRF) grant funded by the Korean government (MSIT) (No. 2020R1F1A107422211).

Feb 10, 2022

#SiC #CMOS Technology for High Temperatures



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February 10, 2022 at 12:55PM
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#Analog #IC #design #Hackathon Digital India



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