The Semiconductor Industry’s Nanoelectronics Research Initiative: Motivation and Challenges

Part-2 in the IEEE SCV Electron Devices Society (EDS) "Semiconductor Roadmap and Beyond" series.

Speaker: Dr. Jeffrey Welser, Director, SRC Nanoelectronics Research Initiative

Time: TUESDAY, Apr 13, 2010 6:00 PM - Pizza , 6:15 PM – Lecture

Cost: Free
Location: National Semiconductor, Building E1, Conference Center ,
2900 Semiconductor Drive , Santa Clara , CA 95051 .
See the NSC Building location map and directions
Contact: Sandeep Bahl

Web link: http://www.ewh.ieee.org/r6/scv/eds/

Alliance CAD System

Alliance CAD System is a free set of EDA tools and portable cell libraries for VLSI design. It covers the design flow from VHDL up to layout. It includes VHDL simulator, RTL synthesis, place and route, netlist extractor, DRC, layout editor: http://alliancecad.sourceforge.net

This project may now be found at http://www-asim.lip6.fr/recherche/alliance/.

IPL group releases PDK standard

What's next? Under this framework, OpenPDK will base its PDK technology on the OpenAcess database. It will also use several of the components developed by IPL: OA schematic symbols, component description format (CDF) and callbacks. For its part, Si2 will attempt to get the industry to develop standards around several other components: Spice models, tech files and DRC/LVS/LPE. [more]

Design, Test, Integration & Packaging of MEMS/MOEMS

DTIP 2010, 5-7 May 2010 , Seville, Spain
DTIP 2010 will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France and in 2009 in Rome, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and CMP.

Download the call for participation.

Before and after

from CrunchGear by John Biggs: