The 2009 IEEE RFIC (Radio Frequency Integrated Circuits) Symposium will be held in Boston, Massachussets, on June 7-9 in conjunction with the IEEE MTT-S International Microwave Symposium (IMS), as part of the Microwave Week 2009.
The IEEE RFIC Symposium is one of the most important IEEE conferences dedicated to the latest innovations in RF and microwave integrated circuits.
The technical areas of RFIC 2009 include RFIC design, RFIC circuits, design methodology, system engineering, RF testing and packaging... And I wish to hightlight that one of the topics explicitly mentioned in the Call for Papers is "Modeling and CAD: RFIC Modeling, Characterization of Active and Passive Devices".
Certainly, RFIC'08, as well as IEEE MTT-S IMS, will allow an easy interaction between high-frequency compact model developers and their potential users.
The deadline for paper submission is January 6 2009.
Sep 26, 2008
IMS'09
The IEEE MTT-S International Microwave Symposium 2009 (IMS 2009) will be held in Boston, Massachussets from June 7 to June 12 2009.
IMS is the largest conference in the field of RF and microwave theory and techniques.
IMS'08 will include workshops, short courses, panels and special sessions
In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).
IMS will be part of the Microwave Week 2009, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.
The deadline for paper submission is December 8 2009.
Last but not least, IMS'08 includes a very interesting social programme.
Certainly Boston is an exciting city that offers many places and activities to enjoy!
IMS is the largest conference in the field of RF and microwave theory and techniques.
IMS'08 will include workshops, short courses, panels and special sessions
In such a large conference, there are many parallel sessions. The scope of IMS is large, and papers on compact modeling of semiconductor devices in the RF and microwave regime can be presented at IMS. In fact, IMS is a very adequate forum for that, because of the presence of the potential users of the device models (designers of RF and microwave circuits).
IMS will be part of the Microwave Week 2009, which will also include a microwave exhibition, the RFIC Symposium and the ARFTG Conference.
The deadline for paper submission is December 8 2009.
Last but not least, IMS'08 includes a very interesting social programme.
Certainly Boston is an exciting city that offers many places and activities to enjoy!
EUROSOI 2009
The 2009 EUROSOI Workshop will be held at Chalmers University, Göteborg (Sweden) on January 19-21 2009.
The EUROSOI Workshop started as an event related to a former Coordination Action (called EUROSOI) funded by the European Commission. This Thematic Network, which includes most of the European teams working on SOI technology, will continue to exist at least until 2011, under the name of EUROSOI+, receiving more funding from the European Commission.
The EUROSOI Workshop has become an international forum to discuss the recent advances on all aspects of SOI technology: materials, devices, modeling, simulation and circuits.
EUROSOI 2008 will be organized by the Chalmers University. The Chairman is Prof Olof Engström, a recognized researcher in nanoscale semiconductor devices, including SOI technology.
The deadline for abstract submission is November 15 2008
Topics include all areas related to SOI technology, devices and circuits. The "SOI MOSFET modeling" topic is explicitly mentioned.
Göteborg is a leading conferences and event city in Europe. There is a strong joint commitment between the business community and the city council to support major events and conferences offering professionalism and excellent organizational skills.
Do not expect a very nice weather in Göteborg in January, but there are many things to see and enjoy in Göteborg.
The EUROSOI Workshop started as an event related to a former Coordination Action (called EUROSOI) funded by the European Commission. This Thematic Network, which includes most of the European teams working on SOI technology, will continue to exist at least until 2011, under the name of EUROSOI+, receiving more funding from the European Commission.
The EUROSOI Workshop has become an international forum to discuss the recent advances on all aspects of SOI technology: materials, devices, modeling, simulation and circuits.
EUROSOI 2008 will be organized by the Chalmers University. The Chairman is Prof Olof Engström, a recognized researcher in nanoscale semiconductor devices, including SOI technology.
The deadline for abstract submission is November 15 2008
Topics include all areas related to SOI technology, devices and circuits. The "SOI MOSFET modeling" topic is explicitly mentioned.
Göteborg is a leading conferences and event city in Europe. There is a strong joint commitment between the business community and the city council to support major events and conferences offering professionalism and excellent organizational skills.
Do not expect a very nice weather in Göteborg in January, but there are many things to see and enjoy in Göteborg.
ISPSD'09
The 21st IEEE International Symposium on Power Semiconductor Devices and ICs will take place in Barcelona (Catalonia, Spain) on June 14-18.
The deadline for abstract submission is October 24 2008.
ISPSD is the main international conference on the areas of power semiconductor devices, power integrated circuits, their hybrid technologies, and applications.
Topics include: processes, materials, CAD/Simulation, devices, power ICs, packaging and applications.
For researchers interested in compact modeling of power semiconductor devices, ISPSD is a top event to present and get to know the last results in this field. "Device & circuit simulation" is explicitly mentioned as one of the subtopic in the "CAD/Simulation" topic. Compact modeling fits very well this subject. And of course, there is a subtopic of "Modeling" in the "Device" topic.
The Conference will take place mainly at the Axa Winterthur Auditorium but some parallel sessions will be held at the NH Constanza Hotel which is just beside the Auditorium.
Certainly Barcelona is a wonderful place to have such an important event. There are many superb attractions in Barcelona: historical landmarks, the well-known modernistic buildings in Gaudi-style, the "Barri Gòtic" (middle-age downtown), the Museum of Fine Arts, or the stadium of the Barça Football Club. And one can find nice beaches very close to Barcelona. The weather in June is usually very good, warm enough to go to the beach, without been too hot.
The deadline for abstract submission is October 24 2008.
ISPSD is the main international conference on the areas of power semiconductor devices, power integrated circuits, their hybrid technologies, and applications.
Topics include: processes, materials, CAD/Simulation, devices, power ICs, packaging and applications.
For researchers interested in compact modeling of power semiconductor devices, ISPSD is a top event to present and get to know the last results in this field. "Device & circuit simulation" is explicitly mentioned as one of the subtopic in the "CAD/Simulation" topic. Compact modeling fits very well this subject. And of course, there is a subtopic of "Modeling" in the "Device" topic.
The Conference will take place mainly at the Axa Winterthur Auditorium but some parallel sessions will be held at the NH Constanza Hotel which is just beside the Auditorium.
Certainly Barcelona is a wonderful place to have such an important event. There are many superb attractions in Barcelona: historical landmarks, the well-known modernistic buildings in Gaudi-style, the "Barri Gòtic" (middle-age downtown), the Museum of Fine Arts, or the stadium of the Barça Football Club. And one can find nice beaches very close to Barcelona. The weather in June is usually very good, warm enough to go to the beach, without been too hot.
Sep 22, 2008
Position in CMOS Compact Modelling
The IHP - Innovations for High Performance Microelectronics (Frankfurt Oder, Germany) invites applications for a position in CMOS Compact Modelling and Technology Support.
The IHP is seeking a candidate with a Master degree in Electrical Engineering or Physics. The main tasks will be:
The main tasks will be:
- SPICE compact modelling of CMOS based devices in IHPs 0.25µm and 0.13µm
technologies
- Electrical measurements and characterization on device level
- Automation of modelling and measurement procedures
- Support statistical analysis of electrical test data
The successful candidates must be highly motivated with basic knowledge in semiconductor device physics and electrical measurement and characterization.
Applicants have to send their application letter/e-mail by September 22, 2008 (if they arrive a few days later they may be considered too) including CV, copies of (scanned) certificates, and addresses of at least one referee to:
Dr. Christel Quick
IHP GmbH
Im Technologiepark 25
15236 Frankfurt (Oder)
Germany
Phone: +49 335 5625 330
Fax: +49 335 5625 666
Email: quick@ihp-microelectronics.com
The IHP is a non-profit making organization which pursues interdisciplinary application-oriented research in the fields of high performance microelectronics and communication, particularly Materials Research, Technology Research, Circuit Design and System Design.
This position offers a unique opportunity to work at the forefront of semiconductor technology in an upcoming new field. The IHP offers a challenging, multinational environment, with excellent career prospects.
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