Showing posts with label
thick polysilicon
.
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Showing posts with label
thick polysilicon
.
Show all posts
Jun 6, 2024
[paper] CMOS-First MEMS-last integration
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Aron Michael, Ian Yao-Hsiang Chuang, Chee Yee Kwok and Kazuo Omaki Low-thermal-budget electrically active thick polysilicon for CMOS-First M...
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