Mar 23, 2021

[mos-ak] [2nd Announcement and C4P] 3rd MOS-AK LAEDC Workshop (virtual/online) April 18, 2021

2nd Announcement and C4P

Together with  local organization team, International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have the pleasure to invite to 3rd consecutive MOS-AK Compact/SPICE Modeling Workshop which will be organized as the virtual/online event on April 18, 2021 preceding the LAEDC Conference.

Planned virtual 3rd MOS-AK LAEDC Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.

Venue: Virtual/Online at LAEDC Conference

Online Workshop Registration to be in April 2021, 
any related enquiries can be sent to registration@mos-ak.org

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:
  • Compact Modeling (CM) of the electron devices
  • Advances in semiconductor technologies and processing
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • Open Source (FOSS) TCAD/EDA modeling and simulation
  • CM of passive, active, sensors and actuators
  • Emerging Devices, Organic TFT, CMOS and SOI-based memory cells
  • Microwave, RF device modeling, high voltage device modeling
  • Nanoscale CMOS, BiCMOS, SiGe, GaN, InP devices and circuits
  • Technology R&D, DFY, DFT and reliability/aging IC designs
  • Foundry/Fabless Interface Strategies
Online Abstract Submission to be open, 
any related enquiries can be sent to abstracts@mos-ak.org

Important Dates: 
  • Call for Papers - Dec. 2020
  • 2nd Announcement - March 2020
  • Final Workshop Program - April 2020
  • MOS-AK Workshop April 18, 2021

WG23032021

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