[C4P] EuroSOI-ULIS 2021, September 1-3, 2021, Caen (F)

The Seventh Joint International EuroSOI and ULIS Conference 

will be held in hybrid format in Caen, Normandy, France

from September 1 to September 3, 2021

After a virtual 2020 edition, if sanitary condition will permit, the 2021 EUROSOI-ULIS event will be held in hybrid format. The conference will be preceded on August 31, 2021 by "The Future of Nanoelectronics Devices and Systems Beyond Moore" Workshop.

The Conference Committee hopes that you will actively participate by submitting high quality papers and will enjoy the conference.
Original 2-page abstracts with illustrations will be accepted for review in pdf format.

Abstract submission is now open. The abstract submission deadline is Mai 17, 2021 Mai 31, 2021. 

More information are provided on the Conference website: 
https://eurosoiulis2021.sciencesconf.org

Papers in the following areas are solicited:

• Advanced SOI materials and structures; physical mechanisms and innovative SOI-like devices.
• New channel materials for CMOS: strained Si, strained SOI, SiGe, GeOI, III-V and high mobility materials on insulator; carbon nanotubes; graphene and other two-dimensional materials.
• Properties of ultra-thin films and buried oxides, defects, interface quality; thin gate dielectrics: high-κ materials for switches and memory.
• Nanometer scale devices: technology, characterization techniques and evaluation metrics for high performance, low power, reliability, high frequency and memory applications.
• Alternative transistor architectures including FDSOI, Nanowire, FinFET, MuGFET, vertical MOSFET, FeFET and Tunnel FET, MEMS/NEMS, Beyond-CMOS nanoelectronic devices.
• New functionalities in silicon-compatible nanostructures and innovative devices representing the More than Moore domain, nanoelectronic sensors, biosensor devices, energy harvesting devices, RF devices, imagers, etc.
• CMOS scaling perspectives; device/circuit level performance evaluation; switches and memory scaling; three-dimensional integration of devices and circuits, heterogeneous integration.
• Transport phenomena, compact modeling, device simulation, front- and back-end process simulation.
• Advanced test structures and characterization techniques, parameter extraction, reliability and variability assessment techniques for new materials and novel devices.
  

Confirmed Plenary Talks Speakers:

• Alexander Zaslavsky (Brown University, USA)
• Anne Vandooren (imec, Belgium)
• Frédéric Allibert (SOITEC, France)
• Jean-Michel Sallèse (EPFL, Switzerland)
• Sorin Cristoloveanu (IMEP Minatec, Grenoble, France)
• Sorin Voinigescu (University of Toronto, Canada)

The authors of the accepted contributions will be requested to provide a 4-page extended abstract which will be included in the Conference Technical Digest which will be published by IEEE and will be available online through IEEE Xplore. Outstanding papers will be invited for publication in a special issue of Solid-State Electronics.

The best paper award, renamed "The Androula Nassiopoulou Best Paper Award" in tribute to her, will be attributed by the SINANO Institute. The best poster award will be attributed by ELSEVIER.

We look forward to seeing you in Caen in 2021 ( https://en.normandie-tourisme.fr/unmissable-sites/caen/things-to-do/).

With best regards,
The EuroSOI-ULIS 2021 Organizing Committee

Note:
We are glad to inform you that 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Proceedings has been posted to the IEEE Xplore digital library
https://ieeexplore.ieee.org/xpl/conhome/9365069/proceeding
If you missed the last edition of EuroSOI-ULIS, do not miss the scientific articles published in the IEEE Xplore database! Many thanks to all authors and attendees for their essential contributions that endorsed EuroSOI ULIS'2020 as a successful virtual conference! Information on EuroSOI-ULIS'2020 virtual edition may be found in the IEEE EDS Newletter published in January 2021 (https://eds.ieee.org/publications/eds-newsletter ; pages  58-60)