Arbeitskreis Modellierung von Systemen und Parameterextraktion
Modeling of Systems and Parameter Extraction Working Group
3rd Sino MOS-AK Workshop
Peking, June 14-16 2018
Together with the Honorary Committee Chair, Yan Wang, Tsinghua University, local organization team and International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to the 3rd Sino MOS-AK Compact/SPICE Modeling Workshop which will be organized at Tsinghua University between June 14-16, 2018.
Planned 3rd Sino MOS-AK Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.
Venue:
会议场所：清华大学FIT-楼，在紫光国际国际交流中心旁
Tsinghua University FIT building, close to Tsinghua Unisplendour International Center
Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:
- Compact Modeling (CM) of the electron devices
- Advances in semiconductor technologies and processing
- Verilog-A language for CM standardization
- New CM techniques and extraction software
- Open Source TCAD/EDA modeling and simulation
- CM of passive, active, sensors and actuators
- Emerging Devices, TFT, CMOS and SOI-based memory cells
- Microwave, RF device modeling, high voltage device modeling
- Nanoscale CMOS devices and circuits
- Technology R&D, DFY, DFT and reliability/ageing IC Designs
- Foundry/Fabless Interface Strategies
Speakers: Invited talks tentative listing (alphabetic order)
- Prof. Mansun Chan; Compact Models for Giga-Scale Memory System
- Dr. Axel Huelsmann; mHEMT based MMICs, Modules, and Systems for mmWave Applications
- Dr.-Ing. Franz Sischka; Successful and Verified RF Measurements for Device Modeling
- Dr. Lifeng Wu; A Full Design Flow Solution for OLED Flat Panel Display
- Dr. Pete Zampardi; Understanding Gaps in III-V HBT Modeling and Simulation
Important Dates:
Online Abstract Submission is open - Call for Papers - March 2018
- 2nd Announcement - April 2018
- Final Workshop Program - May 2018
- MOS-AK Workshop - June 14-16 2018
- Day 1: MOS-AK Tutorial Day
- Day 2: MOS-AK SPICE/Verilog-A Modeling Workshop
- Day 3: MOS-AK SPICE/Verilog-A Modeling Workshop
Manuscript submission deadline: 28th May 2018 (Monday)Notification of Acceptance: 4th June 2018 (Monday)Submission of final manuscript: 11th June 2018 (Monday)
Postworkshop IJHSES Publications:
Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems
International MOS-AK Committee:
- Honorary Committee Chair
- Yan Wang, Tsinghua University
- Advisory Committee
- George Ponchak, T-MTT Editor
- Yuhua Cheng, PKU
- Organizing Committee General Co-Chairs:
- Min Zhang, XMOD Technologies
- Wladek Grabinski, MOS-AK (EU)
- Finance Chair:
- Li Zhang, Tsinghua University
- Publication Chair:
- Wladek Grabinski, MOS-AK (EU)
- Awards Committee Chair:
- Zhiping Yu, Stanford University
- Sponsorship Chair:
- Li Zhang, Tsinghua University
- Min Zhang, XMOD Technologies
- Exhibition Chair:
- Jin Chen, SIMIT
- Kai Lv, NUS
- Local Arrangements Chair:
- Wenfei Hu, Tsinghua University
- Publicity:
- Sen Yin, Tsinghua University
- Workshop Secretary:
- Li Zhang
- Office: +86 010 62771733;
- Mobile: +86 138 01302877
- Email: zhangli95@tsinghua.edu.cn
WG03043018
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