Analysis and modeling of #wafer-level process #variability in #28nm #FDSOI using split C-V measurements https://t.co/M8lmHyZUgN #paper https://t.co/EGJ0xYgMml https://t.co/xHtRIxYSpG

Analysis and modeling of #wafer-level process #variability in #28nm #FDSOI using split C-V measurements https://t.co/M8lmHyZUgN #paper pic.twitter.com/EGJ0xYgMml https://t.co/xHtRIxYSpG

— Wladek Grabinski (@wladek60) April 9, 2018

from Twitter https://twitter.com/wladek60

April 09, 2018 at 05:40PM
via IFTTT