Dec 4, 2013

[mos-ak] SPICE Development Roadmap

The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, delivered its annual autumn compact modeling workshop on Sept. 20, 2013 as an integral part of the ESSDERC/ESSCIRC Conference in Bucharest (RO). The event received full sponsorship from leading industrial partners including Agilent Technologies, LFoundry and Microchip. More than 30 international academic researchers and modeling engineers attended two sessions to hear 12 technical compact modeling presentations and posters including the keynote by Larry Nagel.

The MOS-AK keynote speaker, Larry Nagel, delivered "SPICE in the Twenty-First Century" talk drawing a roadmap of future SPICE development directions. So how will SPICE evolve in the future?  [read more]

In the meantime please also visit <http://www.mos-ak.org/washington_dc_2013/> where we will continue the discussion of all compact/SPICE modeling topics.

--
You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to mos-ak+unsubscribe@googlegroups.com.
To post to this group, send email to mos-ak@googlegroups.com.
Visit this group at http://groups.google.com/group/mos-ak.
For more options, visit https://groups.google.com/groups/opt_out.

No comments:

Post a Comment