SISPAD 2012, Denver, CO, USA, Call for Papers

Call for Papers The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of the leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures. Date and Location Conference date: September 5-7, 2012 Abstract submission deadline: April 1, 2012 Conference location: Sheraton Denver Downtown Hotel, Denver, Colorado, USA Webpage: http://www.ece.umd.edu/sispad2012 Topics Original papers are solicited in the following subject areas: Electronic Transport in Semiconductor Materials and Devices Device Modeling and Simulation Sensors, Biosensors and Electromechanical Systems Simulation Process and Equipment Modeling and Simulation Compact Models Physical-Level Circuit Simulation New Algorithms for Process and Device Modeling Simulation of Nano and Quantum Devices User Interfaces and Visualization Simulation of Power Devices Photovoltaics and Other Green Technologies The abstract should describe the nature of the presentation, together with references. The text must be single-spaced with 11pt or 12pt font. The abstract is limited to two pages including figures, tables and references. Abstracts should be submitted in PDF format. For more information, please visit: http://www.ece.umd.edu/sispad2012/