Nov 4, 2019

IEDM Panel Dec 10 Rest in Peace Moore’s Law, Long Live AI Moderator: Vijay Narayanan, IBM Panelists: Vivek De Intel Wilfried Haensch IBM Mike Henry Mythic Ron Ho Facebook Seongjun Park Samsung Dimitri Strukov UCSB Douglas Yu TSMC https://t.co/G3Yy5XpIPK #paper https://t.co/ffijI0TpMP


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November 04, 2019 at 11:09AM
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BCICTS 2019: 2b. High Frequency Characterisation Tuesday 8:00 AM - Blackbird A/B Session Chair: Breandán Ó hAnnaidh, Analog Devices Co-Chair: Sadayuki Yoshitomi, Toshiba https://t.co/hghKdEx9ty #paper https://t.co/SbPScPM0ee


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November 04, 2019 at 08:28AM
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6 remarkable features of the new #UN #opensource #initiative https://t.co/UCk0xLbtL5 https://t.co/uNGBipmWrx


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November 04, 2019 at 09:29AM
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Nov 1, 2019

#paper: Versatile model for the contact region of organic thin-film transistors A.Romeroab J.Gonzáleza M.J.Deenc J.A.Jiménez-Tejadab https://t.co/9wJwjKlu69 https://t.co/rFCp02RFEF


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November 01, 2019 at 03:56PM
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#Indian #startups have raised a record $11.3B this year – TechCrunch https://t.co/qiJE1BnlV1 #paper https://t.co/yDn1H7aiPJ


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November 01, 2019 at 03:03PM
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Openings for Research Staff and PhD Scholarships Singapore-MIT Alliance for Research and Technology Low Energy Electronic Systems - Phase II 1 CREATE Way 09-01/02 CREATE Tower; 01-13 Enterprise Wing Singapore 138602 https://t.co/hUapbZCyAU #paper https://t.co/VNFXBjlxRY


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November 01, 2019 at 02:01PM
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Program to convert Sandia’s Albuquerque, N.M.-based fab from 150mm (6-inch) to 200mm (8-inch) wafer sizes. As part of the move, Sandia is converting its 0.35-micron (350nm) rad-hard process from 150mm to 200mm. The process is called CMOS7 https://t.co/JrWmF8BV0a #paper https://t.co/FJasxsp3s1


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November 01, 2019 at 01:55PM
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