Dec 13, 2018

IEEE Cledo Brunetti Award 2018 presented to Prof.Dr. Siegfried Selberherr


One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework. An IEEE Fellow, Selberherr is a professor with the Institute for Microelectronics at the Technische Universität Wien, Vienna, Austria.

Dec 10, 2018

[C4P] ESSDERC / ESSCIRC September 23-26, 2019 Kraków, POLAND

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September 23-26, 2019
Kraków, POLAND
ESSDERC/ESSCIRC annual Conference is the most important European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
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CALL FOR PAPERS
ESSCIRC tracks:
Analog 
Data Converters
RF and mm-Wave
Frequency Generation
Wireless and Wireline Systems
Sensors, Imager and Biomedical
Digital, Security and Memory
Power Management
ESSDERC tracks:
CMOS Devices and Technology
Opto-, Power and Microwave Devices
Physical Modeling of Materials and Devices
Compact Modeling of Devices and Circuits
Memory Devices and Technology
Emerging non-CMOS Devices and Technologies
Sensor Devices and Technology
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Technical Co-Sponsorship

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ESSDERC Financial Sponsor

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ESSCIRC Financial Sponsor

ORGANIZERS
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DIAMOND SPONSOR
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RIGAKU


CALL FOR PAPERS



All submissions must be received by
8th April 2019

PAPER SUBMISSION


Manuscript guidelines as well as instructions on how to submit electronically will be soon available on the Conference website. Papers must not exceed four A4 pages with all illustrations and references included.

Papers submitted for review must clearly state:

    - the purpose of the work
    - how and to what extent it advances the state-of-the art
    - specific results and their impact

After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 
31th May 2019.

At the same time, the complete program will be published on the Conference website. An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication.

The submitted final PDF files should be IEEE Xplore compliant.

For each paper independently, at least one co-author is required to register for the Conference (one registration-one paper policy).

ESSDERC
 49th European Solid-State Device Research Conference

ESSCIRC 45th European Solid-State Circuits Conference
September 23-26, 2019Kraków, POLAND

https://esscirc-essderc2019.org

LOCAL SCIENTIFIC SECRETARIAT


Krzysztof Kasinski (AGH UST, PL)
krzysztof.kasinski@agh.edu.pl
Robert Szczygiel (AGH UST, PL)
robert.szczygiel@agh.edu.pl

ESSDERC
/ESSCIRC 2019
ORGANIZING SECRETARIAT


Foundation for AGH
University of Science and Technology

www.fundacja.agh.edu.pl
e-mail
: kf@agh.edu.pl
Anna Inglot – Conference Manager
phone: +48 504 004 517
Copyright 2018 Foundation for AGH UST in Cracow. All rights reserved.
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Dec 9, 2018