Sedemos News

Apr 3, 2018

[mos-ak] [2nd Announcement and Call for Papers] 3rd Sino MOS-AK Workshop Peking, June 14-16 2018

Arbeitskreis Modellierung von Systemen und Parameterextraktion

Modeling of Systems and Parameter Extraction Working Group

3rd Sino MOS-AK Workshop

Peking, June 14-16 2018

Together with the Honorary Committee Chair, Yan Wang, Tsinghua University, local organization team and International MOS-AK Board of R&D Advisers as well as all the Extended MOS-AK TPC Committee, we have pleasure to invite to the 3rd Sino MOS-AK Compact/SPICE Modeling Workshop which will be organized at Tsinghua University between June 14-16, 2018.

Planned 3rd Sino MOS-AK Workshop aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/SPICE modeling and Verilog-A standardization, bring academic and industrial experts in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD/EDA tool developers and vendors.

Venue:

会议场所：清华大学FIT-楼，在紫光国际国际交流中心旁
Tsinghua University FIT building, close to Tsinghua Unisplendour International Center

Topics to be covered include the following among other related to the compact/SPICE modeling and its Verilog-A standardization:

Compact Modeling (CM) of the electron devices
Advances in semiconductor technologies and processing
Verilog-A language for CM standardization
New CM techniques and extraction software
Open Source TCAD/EDA modeling and simulation
CM of passive, active, sensors and actuators
Emerging Devices, TFT, CMOS and SOI-based memory cells
Microwave, RF device modeling, high voltage device modeling
Nanoscale CMOS devices and circuits
Technology R&D, DFY, DFT and reliability/ageing IC Designs
Foundry/Fabless Interface Strategies

Speakers: Invited talks tentative listing (alphabetic order)

Prof. Mansun Chan; Compact Models for Giga-Scale Memory System
Dr. Axel Huelsmann; mHEMT based MMICs, Modules, and Systems for mmWave Applications
Dr.-Ing. Franz Sischka; Successful and Verified RF Measurements for Device Modeling
Dr. Lifeng Wu; A Full Design Flow Solution for OLED Flat Panel Display
Dr. Pete Zampardi; Understanding Gaps in III-V HBT Modeling and Simulation

Important Dates:

Call for Papers - March 2018
2nd Announcement - April 2018
Final Workshop Program - May 2018
MOS-AK Workshop - June 14-16 2018

Day 1: MOS-AK Tutorial Day
Day 2: MOS-AK SPICE/Verilog-A Modeling Workshop
Day 3: MOS-AK SPICE/Verilog-A Modeling Workshop

Online Abstract Submission is open

(any related enquiries can be sent to abstract@mos-ak.org)
Manuscript submission deadline: 28th May 2018 (Monday)
Notification of Acceptance: 4th June 2018 (Monday)
Submission of final manuscript: 11th June 2018 (Monday)

Online Workshop Registration is open

(any related enquiries can be sent to registration@mos-ak.org)

Postworkshop IJHSES Publications:

Selected best MOS-AK technical presentation will be recommended for further publication in a special issue of the International Journal of High Speed Electronics and Systems

International MOS-AK Committee:

Honorary Committee Chair

Yan Wang, Tsinghua University

Advisory Committee

George Ponchak, T-MTT Editor
Yuhua Cheng, PKU

Organizing Committee General Co-Chairs:

Min Zhang, XMOD Technologies
Wladek Grabinski, MOS-AK (EU)

Finance Chair:

Li Zhang, Tsinghua University

Publication Chair:

Wladek Grabinski, MOS-AK (EU)

Awards Committee Chair:

Zhiping Yu, Stanford University

Sponsorship Chair:

Li Zhang, Tsinghua University
Min Zhang, XMOD Technologies

Exhibition Chair:

Jin Chen, SIMIT
Kai Lv, NUS

Local Arrangements Chair:

Wenfei Hu, Tsinghua University

Publicity:

Sen Yin, Tsinghua University

Workshop Secretary:

Li Zhang
Office: +86 010 62771733;
Mobile: +86 138 01302877
Email: zhangli95@tsinghua.edu.cn

Extended MOS-AK Committee

WG03043018

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(NEW DEADLINE: 10 APRIL) ESSDERC Call for Papers

Call for Papers

(NEW DEADLINE: 10 APRIL)

PAPER SUBMISSION: Manuscript guidelines as well as instructions on how to submit electronically ARE AVAILABLE HERE. Papers must not exceed four A4 pages with all illustrations and references included. All submissions must be received by (NEW DEADLINE): 10 APRIL

Papers submitted for review must clearly state:

The purpose of the work
How and to what extent it advances the state-of-the-art
Specific results and their impact

Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference [read more...]

Apr 10, 2018

Detailed characterisation of #Si Gate-All-Around #Nanowire MOSFETs at #cryogenic temperatures https://t.co/Zk7A4wLWM2 #paper https://t.co/n08yBDhilP https://t.co/7WRK6MnPkB

Apr 9, 2018

Analysis and modeling of #wafer-level process #variability in #28nm #FDSOI using split C-V measurements https://t.co/M8lmHyZUgN #paper https://t.co/EGJ0xYgMml https://t.co/xHtRIxYSpG

Low voltage operation of #GaN vertical #nanowire #MOSFET https://t.co/jAwjUJ6I7j #paper https://t.co/3zRydkWQWy

Apr 3, 2018

[mos-ak] [2nd Announcement and Call for Papers] 3rd Sino MOS-AK Workshop Peking, June 14-16 2018

(NEW DEADLINE: 10 APRIL) ESSDERC Call for Papers

Mar 28, 2018

FOSSA: Open-sourcing #opensource #license #management | ZDNet https://t.co/XzdifJOIJR https://t.co/uVoBDgJ6Q5

Mar 26, 2018

Tissue #paper #sensors show promise for health care, entertainment, robotics https://t.co/PssD62ihrx https://t.co/vY0eG5ik5N

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