Jan 6, 2014

[mos-ak] [on-line publications] 6th International MOS-AK Workshop Washington DC Dec.11, 2013

Recent, 6th International MOS-AK/GSA Workshop on Dec.11, 2013 in Washington DC was organized to discuss SPICE/compact modeling and its standardization with a freewheeling session to review modeling activities of the CMC, IEEE EDS CMTC, NEEDS NanoHub and MOS-AK Groups. The workshop's presentations are available on-line at <http://www.mos-ak.org/washington_dc_2013/>

Please also distribute further information about next MOS-AK related events among all who are interested in the SPICE/compact modeling:

IWCM at DAC ASP Singapore (SG) Jan. 23, 2014 
http://www.ece.nus.edu.sg/stfpage/elehy/aspdac2014/
Q2 2014 MOS-AK London (UK) March'2014
http://www.mos-ak.org/london_2014/
MIXDES Lwow (UA) June 19-21, 2014
http://mixdes2014.lp.edu.ua/Mixdes3/tekst/view/special
Q3 MOS-AK at 44th ESSDERC / 40th ESSCIRC Venice (I) Sept. 26, 2014
http://www.mos-ak.org/venice_2014/

Already now, I am looking forward to meet you at one of our MOS-AK modeling events, soon.

-- with regards - wladek;
--
Arbeitskreis Modellierung von Systemen und Parameterextraktion 
Modeling of Systems and Parameter Extraction Working Group
--
Over two decades of Enabling Compact Modeling R&D Exchange
--
--

--
You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to mos-ak+unsubscribe@googlegroups.com.
To post to this group, send email to mos-ak@googlegroups.com.
Visit this group at http://groups.google.com/group/mos-ak.
For more options, visit https://groups.google.com/groups/opt_out.

Dec 4, 2013

[mos-ak] SPICE Development Roadmap

The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, delivered its annual autumn compact modeling workshop on Sept. 20, 2013 as an integral part of the ESSDERC/ESSCIRC Conference in Bucharest (RO). The event received full sponsorship from leading industrial partners including Agilent Technologies, LFoundry and Microchip. More than 30 international academic researchers and modeling engineers attended two sessions to hear 12 technical compact modeling presentations and posters including the keynote by Larry Nagel.

The MOS-AK keynote speaker, Larry Nagel, delivered "SPICE in the Twenty-First Century" talk drawing a roadmap of future SPICE development directions. So how will SPICE evolve in the future?  [read more]

In the meantime please also visit <http://www.mos-ak.org/washington_dc_2013/> where we will continue the discussion of all compact/SPICE modeling topics.

--
You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to mos-ak+unsubscribe@googlegroups.com.
To post to this group, send email to mos-ak@googlegroups.com.
Visit this group at http://groups.google.com/group/mos-ak.
For more options, visit https://groups.google.com/groups/opt_out.

SISPAD 2014 1st Call for Papers


2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9-11, 2014
Workshop, September 8
Mielparque Yokohama, Yokohama, Japan


The call for papers is also available on SISPAD2014 Web site. Deadline for submission of SISPAD abstracts: March 31, 2014


Any inquiries on submission should be sent to:
  • Steering Chair:  Shinji Odanaka  (Osaka Univ)
  • Conference Chair:  Nobuya Mori  (Osaka Univ)
  • Program Chair:  Kenichiro Sonoda  (Renesas)
  • Program Co-Chair:  Shigeyasu Uno  (Ritsumeikan Univ)

Nov 20, 2013

[mos-ak] [Final Program] 6th International MOS-AK/GSA Workshop Washington DC Dec.11, 2013

Final program of 6th International MOS-AK/GSA Workshop on Dec.11, 2013 in Washington DC is available online:
The program includes a freewheeling session organized to review modeling activities of the CMC, IEEE EDS CMTC, NEEDS NanoHub and MOS-AK Groups.

Event venue:
Embassy of Switzerland
2900 Cathedral Ave, NW,  
Washington, DC 20008 
USA 

Free On-line Workshop Registration is open, now.

Extended MOS-AK/GSA Committee:
  • Wladek Grabinski, GMC Suisse; MOS-AK/GSA Group Manager
  • Harrison Beasley, Technical WG Manager, GSA
    MOS-AK/GSA North America
  • Chair: Pekka Ojala, Exar Corporation
  • Co-Chair: Geoffrey Coram, Analog Devices
  • Co-Chair: Prof. Jamal Deen, U.McMaster
  • Co-Chair: Roberto Tinti, Agilent EEsof Division
    MOS-AK/GSA South America
  • Chair: Prof. Gilson I Wirth; UFRGS; Brazil
  • Co-Chair: Prof. Carlos Galup-Montor, UFSC; Brazil
  • Co-Chair: Sergio Bampi, UFRGS, Brazil
  • Co-Chair: Antonio Cerdeira Altuzarra, Cinvestav - IPN, Mexico
    MOS-AK/GSA Europe
  • Chair: Ehrenfried Seebacher, AMS, Austria
  • Co-Chair: Alexander Petr, XFab, Germany
  • Co-Chair: Prof. Benjamin Iniguez, URV, Spain
    MOS-AK/GSA Asia/South Pacific
  • Chair: Sadayuki Yoshitomi, Toshiba 
  • Co-Chair: Xing Zhou, NTU Singapore    
  • Co-Chair: A.B. Bhattacharyya, JIIT New Delhi
 

--
You received this message because you are subscribed to the Google Groups "mos-ak" group.
To unsubscribe from this group and stop receiving emails from it, send an email to mos-ak+unsubscribe@googlegroups.com.
To post to this group, send email to mos-ak@googlegroups.com.
Visit this group at http://groups.google.com/group/mos-ak.
For more options, visit https://groups.google.com/groups/opt_out.

Nov 13, 2013


2014 Workshop on Compact Modeling at techconnectworld.com



Abstracts due: December 13th, 2013

Synopsis: Compact Models (CMs) for circuit simulation have been at the heart of CAD tools for circuit design over the past decades, and are playing an ever increasingly important role in the nanometer system-on-chip (SOC) era. As the mainstream MOS technology is scaled into the nanometer regime, development of a truly physical and predictive compact model for circuit simulation that covers geometry, bias, temperature, DC, AC, RF, and noise characteristics becomes a major challenge.

Workshop on Compact Modeling (WCM) Is one of the first of its kind in bringing people in the CM field together. The objective of WCM is to create a truly open forum for discussion among experts in the field as well as feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development and deployment, within the main theme - compact models for circuit simulation.

Symposium Chair: Professor Xing Zhou Nanyang Technological University, Singapore

Nov 11, 2013

[Call for Papers] IWCM 2014

Call for Papers IWCM 2014 
11th International Workshop on Compact Modeling 
January 23 (Thursday), 2014 
Suntec Singapore Convention and Exhibition Centre (Room 309)  
Scope: 
The workshop provides an opportunity for the discussion and the presentation of advances in modeling and simulation of integrated circuits.

Topics: 
  • Compact modeling for all kinds of devices 
  • Parameter extraction methodology and strategy 
  • Circuit simulation techniques and platforms 

Abstract Submission:
Authors should submit a camera-ready abstract with 2 to 10 pages including figures for inclusion in the Workshop Proceedings, and send the electronic file in PDF or MS-Word format to mchan@ust.hk. Paper templates in Word format is downloadable from the ASP-DAC 2014 site. Deadline for the submission is December 15th, 2013. 
  • Organization:
    Chair: Mansun Chan (Hong Kong University of Science and Technology, Hong Kong)
    Co-Chair: Hans Juergen Mattausch (Hiroshima University, Japan) 
  • Committee members:
    T. Aikyou (STARC, Japan)
    Y. Cao (Arizona State University, USA)
    Jamel Deen (McMaster University, Canada)
    J. He (Peking University, China)
    Y. J. Park (Seoul National University, Korea)
    Zhiping Yu, (Tsinghua University, China)
    Xing Zhou (Nanyang Technology University, Singapore) 
Sponsor:
The University Grant Council of Hong Kong through the Area of Excellence Project (AOE/P-04/08)

Fee: Free admission

Contact: 
If you have any question, please contact  Mansun Chan

Nov 9, 2013

LETI Devices Workshop

The Churchill Hotel - 1914 Connecticut Ave. NW (across from the Hilton)
Washington D.C. 6-9 p.m on December 8, 2013

Inventing the future together: a stimulating discussion of our vision for silicon nanotechnologies in the next 10 years followed by a networking cocktail. Program is as follow:
  • Introduction (10min)
    Jean-RenĂ© Lequepeys; VP Silicon Components Division 
  • Lithography cost-effective solutions for 1X nodes (15min)
    Serge Tedesco; Lithography Program Manager 
  • 3D: Dream and reality (15 min)
    Mark Scannell; Senior Business Development Manager 
  • High-performance and reliable resistive memories embedded in advanced logic CMOS technologies (15min)
    Barbara de Salvo; Advanced Memories Fellow
  • M&NEMS platforms: an enabler for the next generation of sensors in consumer electronics (15min)
    Hugues Metras; VP Strategic Partnerships, North America
  • CMOS technologies: our most power efficient solution today and our vision toward 10nm node and beyond (15 min)
    Maud Vinet; Advanced CMOS Manager
[read more...]