Wednesday, 4 December 2013

[mos-ak] SPICE Development Roadmap

The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, delivered its annual autumn compact modeling workshop on Sept. 20, 2013 as an integral part of the ESSDERC/ESSCIRC Conference in Bucharest (RO). The event received full sponsorship from leading industrial partners including Agilent Technologies, LFoundry and Microchip. More than 30 international academic researchers and modeling engineers attended two sessions to hear 12 technical compact modeling presentations and posters including the keynote by Larry Nagel.

The MOS-AK keynote speaker, Larry Nagel, delivered "SPICE in the Twenty-First Century" talk drawing a roadmap of future SPICE development directions. So how will SPICE evolve in the future?  [read more]

In the meantime please also visit <http://www.mos-ak.org/washington_dc_2013/> where we will continue the discussion of all compact/SPICE modeling topics.

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SISPAD 2014 1st Call for Papers


2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9-11, 2014
Workshop, September 8
Mielparque Yokohama, Yokohama, Japan


The call for papers is also available on SISPAD2014 Web site. Deadline for submission of SISPAD abstracts: March 31, 2014


Any inquiries on submission should be sent to:
  • Steering Chair:  Shinji Odanaka  (Osaka Univ)
  • Conference Chair:  Nobuya Mori  (Osaka Univ)
  • Program Chair:  Kenichiro Sonoda  (Renesas)
  • Program Co-Chair:  Shigeyasu Uno  (Ritsumeikan Univ)