Friday, 25 October 2013

MIEL2014 Abstracts Deadline Extension

IEEE 29th International Conference on Microelectronics (MIEL 2014) is to be held on 11-14 May 2014 at the Serbian Academy of Science and Arts, Belgrade, Serbia. The extended submission deadline for 2-page extended abstracts of regular contributions had been set to 26th, but, due to many requests by authors, we will continue receiving the submissions by October 31st 2013.

More detailed information on MIEL 2014 can be found in the attached Call for Papers, as well as on the conference web site http://miel.elfak.ni.ac.rs/. We will be looking forward to receiving your submission and seeing you at our conference next year in May.

[read more...]

Tuesday, 22 October 2013

SISPAD Abstract Submission

2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014
Workshop, September 8
Mielparque Yokohama, Yokohama, Japan

Deadline for submission of SISPAD abstract: March 1, 2014

Any inquiries on submission should be sent to:
  • Program Chair:  Ken’ichiro Sonoda (Renesas)
  • Program Co-Chair:  Shigeyasu Uno (Ritsumeikan Univ)

Tuesday, 15 October 2013

[mos-ak] note in the IEEE EDS REGIONAL AND CHAPTER NEWS

REGIONAL AND CHAPTER NEWS
ED Germany – by Joachim N. Burghartz 

The German Chapter of IEEE EDS sponsored the annual spring compact modeling workshop of the MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held April 11– 12, 2013. The meeting was supported by Prof. Doris Schmid-Landsiedel and the staff of the Institute for Technical Electronics, TUM, Munich, who is one of the local coordinators of the ED German Chapter. More than 30 international academic researchers and modeling engineers attended three sessions to listen to 12 technical compact modeling presentations. As in previous years this well-established effort has been coordinated by Wladek Grabinski, Switzerland. The workshop's three sessions focused on common compact modeling actions. Sessions included: (i) How to consolidate and build consistent simulation hierarchy at all levels of advanced TCAD numerical modeling; (ii) Compact/ SPICE modeling for Analog / Mixed Signal circuits; and (iii) Corner modeling and statistical simulations. The MOS-AK/GSA speakers were K.-W. Pieper (Infineon), M. Sylvester (MunEDA), B. IƱiguez (URV), I. Nickeleit (Agilent), L. Heiss (LTE, TUM); T. Schulz (Intel), C. Jungemann (RWTH), M. Brinson (London Metropolitan University), B.-Y. Nguyen (SOITEC), A. Kloes (THM), U. Monga (Intel), and M. Bucher (TUC). The event was accompanied by a series of the software/hardware demos by MOS-AK/GSA industrial partners: Agilent, MunEDA and Tanner EDA. The session technical and software/ hardware demo presentations are available for download at: <http:// www.mos-ak.org/munich_2013/>. 

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Wednesday, 2 October 2013

OBip: Open Bipolar Workshop at BCTM in Bordeaux

Open Workshop on European Bipolar related projects: 
Abstract: In Europe, a huge effort is actually undertaken to strengthen Europe's leading edge position in SiGe HBT technology and modeling as well as SiGe enabled mm-wave applications thanks to two European projects that are: DOTSEVEN which aims to achieve HBTs with cut-off frequencies (fmax) of around 700 GHz and RF2THz which aims at the establishment of a 300mm BiCMOS Silicon technology platform for emerging RF, mm-wave and THz consumer applications, as well as Si photonics integration. During this common workshop the main achievements of these projects will be presented.

Opening and Welcome (8:15 AM), Thomas Zimmer, University  Bordeaux 1

Session 1: Technology (8:30 - 10:30 AM)
Alexander Fox, IHP (8:30 - 9:10 AM)
   SiGe HBT Technology Development in the DOTSEVEN  Project
Pascal Chevalier, ST Microelectronics (9:10 - 9:50 AM)
   A 55-nm BiCMOS Platform for Optical and Millimeter-Wave  Systems-on-Chip
Dieter Knoll, IHP (9:50 – 10:30 AM)
   BiCMOS integration of photonic components
Coffee break
Session 2: Modelling and Characterization (11:00 AM – 1:00 PM)
Andreas Pawlak, Univ. of Dresden (11:00 – 11:40 AM)
   Latest developments of HICUM/L2 for mm-wave applications
Bertrand Ardouin, XMOD Technologies (11:40 – 12:20 AM)
   Tools and environment for Sub-THz circuit design
Sebastien Fregonese, CNRS (12:20 AM – 1:00 PM)
   Electro-Thermal Device Characterization & Modelling
Lunch break
Session 3: Design and demonstrator (2:00 – 4:00 PM)
Marco Spirito, University of Delft (2:00 – 2:40 PM)
   Building blocks and system architecture for mm-wave imaging radar
Olivier Tesson, NXP (2:40 – 3:20 PM)
   Passive integration and Packaging for mm-wave applications
Wolfgang Templ, Alcatel Lucent (3:20 – 4:00 PM)
   Application Scenarios from RF2THz

4:00: End of the Open Bipolar Workshop OBip

[read more: 3rd Day Workshop: Special European Dot 5/Dot 7 Workshop]